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6 results on '"Soong, Yu-Chian"'

4. Controlling the Structures, Flexibility, Conductivity Stability of Three-Dimensional Conductive Networks of Silver Nanoparticles/Carbon-Based Nanomaterials with Nanodispersion and their Application in Wearable Electronic Sensors

Author

Chiu, Chih-Wei, primary, Li, Jia-Wun, additional, Huang, Chen-Yang, additional, Yang, Shun-Siang, additional, Soong, Yu-Chian, additional, Lin, Chih-Lung, additional, Lee, Jimmy Chi-Min, additional, Lee Sanchez, William Anderson, additional, Cheng, Chih-Chia, additional, and Suen, Maw-Cherng, additional

Published
2020
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5. Adsorption Performance for Reactive Blue 221 Dye of β-Chitosan/Polyamine Functionalized Graphene Oxide Hybrid Adsorbent with High Acid–Alkali Resistance Stability in Different Acid–Alkaline Environments

Author

Chiu, Chih-Wei, primary, Wu, Ming-Tsung, additional, Lin, Chih-Lung, additional, Li, Jia-Wun, additional, Huang, Chen-Yang, additional, Soong, Yu-Chian, additional, Lee, Jimmy Chi-Min, additional, Lee Sanchez, William Anderson, additional, and Lin, Hsuan-Yu, additional

Published
2020
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6. Enhanced Thermal Conductivity of Epoxy Composites Filled with Al 2 O 3 /Boron Nitride Hybrids for Underfill Encapsulation Materials.

Author

Lee Sanchez, William Anderson, Huang, Chen-Yang, Chen, Jian-Xun, Soong, Yu-Chian, Chan, Ying-Nan, Chiou, Kuo-Chan, Lee, Tzong-Ming, Cheng, Chih-Chia, and Chiu, Chih-Wei

Subjects
FLIP chip technology, THERMAL conductivity, BORON nitride, EPOXY resins, GLASS transition temperature, NITRIDES, THERMAL expansion
Abstract

In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging. [ABSTRACT FROM AUTHOR]

Published
2021
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