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Abstract A series of siloxane‐containing polyimide films (PIS) were prepared by copolymerising with rigid aromatic dianhydride, siloxane diamines and six different aromatic diamines. The effects of siloxane structures, fluorine and imide content, rigid or flexible segment on the heat resistance, moisture absorption, dielectric performance, mechanical and bonding properties were systematically studied. The results show that PIS films maintain good heat resistance with Tg between 292 and 420°C and 5% weight loss temperature higher than 500°C. The moisture absorption and dielectric constant can be significantly reduced due to the presence of siloxanes and fluorinated groups, with the absorption rate as low as 1.2% and dielectric constant of 2.85 at 1 MHz. When measured at 10 GHz, the dielectric constant ranges from 3.10 to 3.50, and dielectric loss varies from 0.0059 to 0.0098. The PIS‐6 film has the best comprehensive performance due to the low imide content, introduction of trifluoromethyl and ether bonds. The peeling strength of bonding PIS‐6 film with a copper foil can reach 9.2 N/cm. It is proven that siloxane‐containing PIS films with high heat resistance, low dielectric and outstanding adhesion are achieved, which can be applied for flexible integrated circuit boards, high‐frequency electronics and microelectronics fields.

Objective Recent studies have shown that blood urea nitrogen to creatinine (BUN/Cr) ratio might be an effective marker for the prognosis of patients with respiratory diseases. Herein, we aimed to assess the association between BUN/Cr ratio and the risk of in-hospital mortality in patients with trauma-related acute respiratory distress syndrome (ARDS).Design A retrospective cohort study.Setting and participants 1034 patients were extracted from the Medical Information Mart for Intensive Care-III (MIMIC-III) database.Primary and secondary outcome measures The primary outcome of the study was in-hospital mortality, defined by the vital status at the time of hospital discharge (ie, survivors and non-survivors).Results Of the total patients, 191 (18.5%) died in hospital. The median follow-up duration was 16.0 (8.3–26.6) days. The results showed that high level of BUN/Cr ratio was significantly associated with an increased risk of in-hospital mortality (15.54–21.43: HR=2.00, 95% CI: (1.18 to 3.38); >21.43: HR=1.76, 95% CI: (1.04 to 2.99)) of patients with trauma-related ARDS. In patients with trauma-related ARDS that aged ≥65 years old, male and female, Onychomycosis Severity Index (OSI)>98, Revised Trauma Score (RTS)>11, Simplified Acute Physiology Score II (SAPS-II)>37 and sequential organ failure assessment (SOFA) scores≤7, BUN/Cr ratio was also related to the increased risk of in-hospital mortality (all p

Abstract High‐performance solar‐blind photodetectors are widely studied due to their unique significance in military and industrial applications. Yet the rational molecular design for materials to possess strong absorption in solar‐blind region is rarely addressed. Here, an organic solar‐blind photodetector is reported by designing a novel asymmetric molecule integrated strong solar‐blind absorption with high charge transport property. Such alkyl substituted [1]benzothieno[3,2‐b][1]‐benzothiophene (BTBT) derivatives Cn‐BTBTN (n = 6, 8, and 10) can be easily assembled into 2D molecular crystals and perform high mobility up to 3.28 cm2 V−1s−1, which is two orders of magnitude higher than the non‐substituted core BTBTN. Cn‐BTBTNs also exhibit dramatically higher thermal stability than the symmetric alkyl substituted C8‐BTBT. Moreover, C10‐BTBTN films with the highest mobility and strongest solar‐blind absorption among the Cn‐BTBTNs are applied for solar‐blind photodetectors, which reveal record‐high photosensitivity and detectivity up to 1.60 × 107 and 7.70 × 1014 Jones. Photodetector arrays and flexible devices are also successfully fabricated. The design strategy can provide guidelines for developing materials featuring high thermal stability and stimulating such materials in solar‐blind photodetector application.

Carbon fiber reinforced thermosetting polyimide (CF/TSPI) composites were interleaved with thermally stable thermoplastic polyimide (TPPI) fiber veils in order to improve the interlaminar fracture toughness without sacrificing the heat resistance. Both of the mode I and mode II interlaminar fracture toughness (GIC and GIIC) for the untoughened laminate and TPPI fiber veils interleaved laminates were characterized by the double cantilever beam (DCB) test and end notch flexure (ENF) test, respectively. It is found that the TPPI fiber veils interleaved laminates exhibit extremely increased fracture toughness than the untoughened one. Moreover, the areal density of TPPI greatly affected the fracture toughness of laminates. A maximum improvement up to 179% and 132% on GIC and GIIC is obtained for 15 gsm fiber veils interleaved laminate, which contributes to the existence of bicontinuous TPPI/TSPI structure in the interlayer according to the fractography analysis. The interlaminar fracture behavior at elevated temperatures for 15 gsm fiber veils interleaved laminate were also investigated. The results indicated that the introduction of thermally stable TPPI fiber veils could enhance the fracture toughness of CF/TSPI composites by exceeding 200% as compared to the untoughened one even as tested at 250 °C.

A series of 4-phenylethnylphthalic anhydride (PEPA)-terminated oligoimides were prepared by co-oligomerizing isomeric dianhydrides, i.e., 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA), 2,3,3′,4′-benzophenonetetracarboxylic dianhydride (a-BTDA) or 2,3,3′,4′-diphenylethertetracarboxylic dianhydride (a-ODPA), with diamines mixture of bis(4-aminophenoxy)dimethyl silane (APDS) and 2,2′-bis(trifluoromethyl) benzidine (TFDB). The effects of siloxane content and dianhydride structure on the rheological properties of these oligoimides and thermal stability of the corresponding cured polyimide resins were investigated. The results indicated that the introduction of the siloxane structure improved the melt processability of the oligoimides, while the thermal stability of the cured polyimide resins reduced. The oligoimide derived from a-ODPA revealed better melt processability and melt stability due to the existence of a flexible dianhydride structure. The oligoimide PIS-O10 derived from a-ODPA gave the lowest minimum melt viscosity of 0.09 Pa·s at 333 °C and showed the excellent melt stability at 260 °C for 2 h with the melt viscosity in the range of 0.69–1.63 Pa·s. It is also noted that the thermal stability of these resins can be further enhanced by postcuring at 400–450 °C, which is attributed to the almost complete chemical crosslinking of the phenyethynyl combined with oxidative crosslinking of siloxane. The PIS-T10 and PIS-O10 resins that were based on a-BTDA and a-ODPA, respectively, even showed a glass transition temperature over 550 °C after postcuring at 450 °C for 1 h.

The gap effect is a key factor in the design of the heat sealing in supersonic vehicles subjected to an aerodynamic heat load. Built on S-A turbulence model and Roe discrete format, the aerodynamic environment around a gap on the surface of a supersonic aircraft was simulated by the finite volume method. As the presented results indicate, the gap effect depends not only on the attack angle, but also on the Mach number.

The interfacial structure of poly(styrene) (PS)-poly(methyl acrylate) (PMA) structured latices has been investigated by means of modulated-temperature differential scanning calorimetry (M-TDSC) and small-angle x-ray scattering (SAXS). The differential of heat capacity, dCp/dT, signal from M-TDSC was used to quantify the weight fraction of interface in these latices. For PS-PMA (50:50 by weight) structured latices in which the PS component had different crosslink densities (0, 1, 3, 5 and 10 mol% of crosslinking agent), the weight fraction of interface was about 13%. With increasing crosslink density, the fraction of interface increased only slightly. A core-shell model has been used to analyse SAXS data for these PS-PMA latices. M-TDSC can only provide information about the weight fraction of interface, but the combination of M-TDSC and SAXS can provide much more information on the morphology of such structured latices.