175 results on '"Song, Jun-Yeob"'
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2. Fs pulse laser-based, micro LED chips transfer technology
3. Structural Analysis of Thin Film with Applied Pre-Strain in Substrate
4. Continuous Patterning of Silver Nanowire-Polyvinylpyrrolidone Composite Transparent Conductive Film by a Roll-to-Roll Selective Calendering Process
5. Development of a Next Generation Stretchable Substrate for Micro-LED Application
6. Hybrid Solder with silver hierarchical structure and particle for Synergistic effect in shear strength of die attach behaviour
7. Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging
8. A Simulation Study for Micro Assembly Cell in a Micro Lens Module Industry
9. Low Height Wire bond Looping Technology using Wedge Bonding for the MMIC Package
10. Machine learning-based solution for thermo-mechanical analysis of MMIC packaging
11. Failure mechanism of copper through-silicon vias under biased thermal stress
12. Finite Element Analysis for Safe Design of a Flexible Microelectronic System under Bending Deformation
13. Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging.
14. Continuous Patterning of Silver Nanowire-Polyvinylpyrrolidone Composite Transparent Conductive Film by a Roll-to-Roll Selective Calendering Process.
15. Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process
16. The development of embedded device to detect chatter vibration in machine tools and CNC-based autonomous compensation
17. Development and evaluation of prototype system for harbor container delivery & cargo work automation
18. Manufacturing message specification (MMS) based open manufacturing system
19. Development and evaluation of Zigbee node module for USN
20. Development and evaluation of intelligent machine tools based on knowledge evolution in M2M environment
21. Efficiency evaluation of micro factory for micro pump manufacture
22. Design of pollution preventing system for camera window
23. Open manufacturing system using MMS service and object oriented manufacturing equipments
24. Knowledge-evolutionary intelligent machine-tools —Part 1: Design of dialogue agent based on standard platform
25. Ubiquitous-based mobile control and monitoring of CNC machines for development of u-machine
26. Diagnosing the cause of operational faults in machine tools with an open architecture CNC
27. Mechanical analysis of a flexible microelectronic system under twisting stress
28. Rheological properties and microstructures of Carbopol gel network system
29. A Simulation Study for Micro Assembly Cell in a Micro Lens Module Industry
30. APPLICATION OF VIRTUAL MANUFACTURING IN DEVELOPING MANUFACTURING SYSTEM FOR THE LENS MODULE OF PHONE-CAMERA
31. Evaluation of Crack Propagation at the Interconnection Interface Induced by Warpage of Fan-Out Wafer-Level-Package
32. Reliability Evaluation System of Electronics Components
33. A Comparative Study on the Vibration Signal-Based Damage Detection for Rotor-Bearing System in Speed-Up Process:The Feature Extraction Approach
34. Reliability Assessment Approach Using Failure Mode Analysis in Machining Center
35. Strength Design and Minimization of Residual Stresses in Reversible GaAs Wafer Bonding Process
36. Study on the Embedded Flexible Hybrid Stack Package using Polymer Elastic Bump Interconnection Method
37. Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substate for Flexible Wearable Devices
38. Experimental investigation on micro-fabrication of wearable dry-patching flexible substrate using transparent superhydrophobic polyimide
39. Face-up Interconnection Technique Using Direct Image Writing for Three-Dimensional Heterogeneous Flexible Electronics
40. Polymer elastic bump formation through photodefinable thermal reflow process for system in foil package
41. Development of PEB Face-Down Interconnect Process for Wearable Device
42. Machined Shape Error Measurement and Self-origin Recognition of Workpiece for Mobile Machine Tool
43. Mobile and remote operation for M2M application in upcoming u-manufacturing
44. Fabrication of dry-patching superhydrophobic flexible platform for HySiF (hybrid system in flexible) applications
45. Development of PEB face-down interconnection process for ultra thin flexible package
46. Equipment Maintenance Environment Based on Field-Data of Root Industry by Manufacturing-Field Analysis
47. Knowledge-Evolutionary Intelligent Machine Tools - Part 1: Design of Dialogue Module based on Agent Standard Platform in M2M Environment
48. Investigation of Mechanical Stress Distribution in Flexible Microelectronic System Under Bending Force By Finite Element Analysis
49. Control of Position of Neutral Line in Flexible Microelectronic System Under Bending Stress
50. Injection-moulded lens form error prediction using cavity pressure and temperature signals based on k-fold cross validation
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