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Increasing the power density and heat dissipation in electronic equipment and their need for an efficient thermal management system have made the liquid cooling techniques inevitable in recent years. In most applications, liquid cooling systems work in conjunction with more traditional cooling methods, such as conduction and convection heat transfer, using air cooling systems. In this study, the performance of Reciprocating Mechanism‐Driven Heat Loop (RMDHL) for electronic and power electronic cooling applications has been studied and compared with that of a conventional Dynamic Pump‐Driven Heat Loop (DPDHL). A numerical model using moving boundaries in Ansys Fluent commercial code has been developed to generate the reciprocating motion of working fluid with desired frequency and amplitude. The temperature distribution contours and Nusselt numbers show the superior performance of the RMDHL system in terms of heat transfer and temperature uniformity of the heated surface. The results show that, for the same average mass flow rate in the cooling loops the average surface temperature in the RMDHL loop is considerably lower than that of DPDHL especially at higher reciprocating frequency. The results also indicate that similar to the effect of the oscillatory frequency, increasing the amplitude also increases the heat transfer rate in the RMDHL loop. In addition, the Nusselt number shows a linear increment with the increase of both oscillatory amplitude and frequency. Uniform temperature distribution and efficiency of thermal management systems based on RMDHL loop could decrease the resultant thermal stress in electronic devices and increase the reliability of them. [ABSTRACT FROM AUTHOR]