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Considering the significant threat of heat to electronic equipment and the heat dissipation problems existing in powerful systems, thermal management materials are in high demand. In conjunction with the increasing desire of dissipating heat and stabilizing temperature, high thermal conductivity and phase change latent heat are attracting more attention when designing thermal management material. This work proposes a strategy to combine phase change matrix and thermally conductive filler using freeze casting. The highest thermal conductivity reaches 23.1 W m-1 K-1 accompanied by 62 J g-1 phase change latent heat. Meanwhile, replacing ice with organic phase change material in freeze casting can result in an aligned structure. This discovery will pave a novel way for introducing thermal latent heat without abandoning the aligned structure.

To deal with the heat dissipation problem produced by a high integrated circuit, the preparation of heat spreaders with excellent heat transportation performance is increasing in demand. The Ti3C2 MXene sheets and copper particles were fully contacted with cellulose nanofibers by a high-speed mixer, and the composite film was prepared as a heat spreader under the action of the vacuum-assisted filtration. The MXene sheets are connected by the esterification of the carboxyl group in MXene and the hydroxyl group in cellulose nanofibers to form a chemical bond and consist of the main skeleton of the composite film. Due to the synergistic effects of MXene and copper particles, the in-plane and out-of-plane thermal conductivities of the composite film reach 24.96 and 2.46 W m−1 K−1, respectively. Compared with the pure cellulose nanofiber films, the thermal conductivity of composite films increased by 2819.2 and 187.6%, respectively. By designing two applications of composite films in the actual use process, the excellent heating conduction abilities in two directions have been proved. This measure to improve the thermal conductivities of composite films by MXene-copper binary fillers also provides ideas for the novel heat spreader.

Simultaneous achievement of high thermal transportation performance and superior mechanical properties in a same thermal management composite film.

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing the thermal conductivity of polymer composites. In this work, a three-dimensional porous diamond framework was prepared by depositing nano-crystalline diamond on alumina foam which was impregnated with epoxy to obtain a nano-crystalline diamond@alumina foam/epoxy composite. The epoxy composite with nano-crystalline diamond@alumina foam demonstrated a thermal conductivity of 2.21 W m-1 K-1, which was increased by 1063% in comparison with pure epoxy. The thermal conductivity of the epoxy composite measured under various conditions and heat transport applications demonstrates that it possesses excellent thermal transportation and stability properties. This work provides a new idea to significantly enhance the thermal transportation properties of epoxy composites in the application of advanced packaging materials.

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.

Polymer composites with high thermal conductivity possess light weight, easy process and high chemical resistance, which has a huge demand in electronic packaging fields. Therefore, the development of new filler for improving the thermal conductivity has attracted lots of attentions in the field of polymer composites. In this work, a new hybrid filler was prepared through depositing nano-crystalline diamonds on SiC nanowires by hot filaments chemical vapor deposition . The results of SEM and TEM characterizations showed that the filler has a novel structure which is similar as a string of “sugar-coated haws on a stick” (a kind of Chinese candied fruit, named Tanghulu). Polymer composites containing the filler with the Tanghulu-like structure presented the high thermal conductivity of 0.57 W m −1 K−1 under 25 wt% filler contents. The excellent thermal conduction performance is attributed to the regional continuous networks formed by filler with the Tanghulu-like structure. Infrared images and a cooling radiator were utilized to further confirm the high thermal transportation performance of the polymer composites. The development of Tanghulu-like diamond@silicon carbide nanowires proposes a new strategy to prepare polymer composites with enhanced thermal conductivity, which will further promote the application in electronic packaging fields.