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AbstractThe static and dynamic pull-in characteristics of electrostatically and piezo-electrically actuated microbeam are investigated. The static pull-in voltage is evaluated using analytical methods based on MCST, CCMT and validated through the use of FE based COMSOL multiphysics tools. The dynamic pull-in voltage obtained from numerical technique and verified with existing literature, lower than the static pull-in voltage. The piezoelectric patch has a significant influence on the pull-in voltage and an effect on the aspect ratio. Moreover, the pull-in band and instability zone of the microbeam with weak and hard forcing function have been investigated using multiple scale method. [ABSTRACT FROM AUTHOR]

In this article, the propagation and scattering of Rayleigh wave from an interfacial crack in a bilayer structure, a viscoelastic waveguide layer attached to a piezoelectric substrate, have been examined. The Principle of Superposition is used to formulate the problem. The Fourier transform method and stiffness matrix formulation have been used to arrive at singular integral equations. These singular integral equations are then reduced to a system of linear algebraic equations by applying the Gauss-Jacobi quadrature technique. A parametric study has been examined for phase velocity, attenuation, and dynamic stress intensity factor of mode-I and mode-II at both crack-tip. [ABSTRACT FROM AUTHOR]

This study uses an analytical method to examine the scattering of a Love wave from an interfacial crack in a thin lossy media (viscoelastic material) that serves as a waveguide layer attached to an unbounded loss-less media (piezoelectric material). The viscoelastic material is modeled using the Kelvin–Voigt equation. Phase velocity and attenuation have been calculated by equating the real and imaginary parts of the dispersion relation to zero, respectively, due to the complex wave number of viscoelastic material. Using the integral transform approach and the dislocation density function, the scattering field close to the crack tip is determined, resulting in a Cauchy singular integral equation of the first type. It has been transformed into a system of linear algebraic equations using Gauss-Chebyshev numerical integration. It has been investigated how frequency, waveguide layer thickness, and viscoelastic material loss factor affect phase velocity and Love wave attenuation. The mode-III dynamic stress intensity factor at the left and right crack-tip is investigated for various thicknesses of the waveguide layer and loss factor of viscoelastic material. The outcomes were verified using numerical data from the COMSOL Multiphysics 5.6 FEA software. The findings are fundamental and could be used in the design of particular sensors. [ABSTRACT FROM AUTHOR]