11 results on '"Saugier, E."'
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2. New challenges and opportunities for 3D integrations
3. Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
4. HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution
5. 3D integration demonstration of a wireless product with design partitioning
6. TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration
7. Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications
8. Development and characterisation of high electrical performances TSV for 3D applications
9. 3D integration technology for set-top box application
10. TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration.
11. Development and characterisation of high electrical performances TSV for 3D applications.
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