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Ferroelectricity in hafnium zirconium oxide (Hf1 − xZrxO2) and the factors that impact it have been a popular research topic since its discovery in 2011. Although the general trends are known, the interactions between fabrication parameters and their effect on the ferroelectricity of Hf1 − xZrxO2 require further investigation. In this paper, we present a statistical study and a model that relates Zr concentration (x), film thickness (tf), and annealing temperature (Ta) with the remanent polarization (Pr) in tungsten (W)-capped Hf1 − xZrxO2. This work involved the fabrication and characterization of 36 samples containing multiple sets of metal-ferroelectric-metal capacitors while varying x (0.26, 0.48, and 0.57), tf (10 and 19 nm), and Ta (300, 400, 500, and 600 ° C). In addition to the well-understood effects of x and Ta on the ferroelectricity of Hf1 − xZrxO2, the statistical analysis showed that thicker Hf1 − xZrxO2 films or films with higher x require lower Ta to crystallize and demonstrated that there is no statistical difference between samples annealed to 500 and 600 ° C, thus suggesting that most films fully crystallize with Ta ∼ 500 ° C for 60 s. Our model explains 95% of the variability in the Pr data for the films fabricated, presents the estimates of the phase composition of the film, and provides a starting point for selecting fabrication parameters when a specific Pr is desired. [ABSTRACT FROM AUTHOR]

The effects of low energy (0.45 MeV) electron radiation on the gate and drain currents of [Al.sub.0.27][Ga.sub.0.73]N/GaN HFETs are investigated using IV and CV measurements. Following irradiation, the gate and drain currents increase at low temperatures and reach a saturation level. The gate leakage currents do not fully account for the drain current increase. Following a room temperature anneal, the gate and drain currents return to pre-irradiation levels. These results are explained by the buildup of positive charge in the AlGaN layer at low temperature and traps formed via a complexing precursor in the AlGaN layer near the interface. The positive charge increases the carrier concentration in the 2DEG and hence the drain current. The traps act as trap-assisted-tunneling centers that increase the gate leakage current. Index Terms--Electron irradiation, gallium nitride, heterojunction field effect transistors.