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2. Tin Whiskers Growth in Electronic Assemblies

Author

Chang, M. S., Salleh, Mohd Arif Anuar Mohd, Halin, D. S. C., Mokhtar, N. Z. Mohd, Bergmann, Carlos P., Series Editor, Frade, Jorge R, Editorial Board Member, Carda Castelló, Juan Bautista, Editorial Board Member, Bolmaro, Raul, Editorial Board Member, Esposito, Vincenzo, Editorial Board Member, Salleh, Mohd Arif Anuar Mohd, editor, Abdul Aziz, Mohd Sharizal, editor, Jalar, Azman, editor, and Izwan Ramli, Mohd Izrul, editor

Published
2022
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3. Development of Geopolymer Ceramic-Reinforced Solder

Author

Abdullah, Mohd Mustafa Al Bakri, Salleh, Mohd Arif Anuar Mohd, Zulkifli, Nur Nadiah Izzati, Zaimi, Nur Syahirah Mohamad, Ahmad, Romisuhani, Jamil, Noorina Hidayu, Aziz, Ikmal Hakem, Ramli, Mohd Izrul Izwan, Bergmann, Carlos P., Series Editor, Frade, Jorge R, Editorial Board Member, Carda Castelló, Juan Bautista, Editorial Board Member, Bolmaro, Raul, Editorial Board Member, Esposito, Vincenzo, Editorial Board Member, Salleh, Mohd Arif Anuar Mohd, editor, Abdul Aziz, Mohd Sharizal, editor, Jalar, Azman, editor, and Izwan Ramli, Mohd Izrul, editor

Published
2022
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4. Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process

Author

Aziz, Mohd Sharizal Abdul, Sahrudin, I. N., Rusdi, M. S., Ishak, M. H. H., Khor, C. Y., Salleh, Mohd Arif Anuar Mohd, Bergmann, Carlos P., Series Editor, Frade, Jorge R, Editorial Board Member, Carda Castelló, Juan Bautista, Editorial Board Member, Bolmaro, Raul, Editorial Board Member, Esposito, Vincenzo, Editorial Board Member, Salleh, Mohd Arif Anuar Mohd, editor, Abdul Aziz, Mohd Sharizal, editor, Jalar, Azman, editor, and Izwan Ramli, Mohd Izrul, editor

Published
2022
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5. Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics

Author

Somidin, Flora, Said, Rita Mohd, Saud, Norainiza, Salleh, Mohd Arif Anuar Mohd, Bergmann, Carlos P., Series Editor, Frade, Jorge R, Editorial Board Member, Carda Castelló, Juan Bautista, Editorial Board Member, Bolmaro, Raul, Editorial Board Member, Esposito, Vincenzo, Editorial Board Member, Salleh, Mohd Arif Anuar Mohd, editor, Abdul Aziz, Mohd Sharizal, editor, Jalar, Azman, editor, and Izwan Ramli, Mohd Izrul, editor

Published
2022
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9. Development of Geopolymer Ceramic-Reinforced Solder

Author

Abdullah, Mohd Mustafa Al Bakri, primary, Salleh, Mohd Arif Anuar Mohd, additional, Zulkifli, Nur Nadiah Izzati, additional, Zaimi, Nur Syahirah Mohamad, additional, Ahmad, Romisuhani, additional, Jamil, Noorina Hidayu, additional, Aziz, Ikmal Hakem, additional, and Ramli, Mohd Izrul Izwan, additional

Published
2022
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15. Mechanical Performance, Microstructure, and Porosity Evolution of Fly Ash Geopolymer after Ten Years of Curing Age

Author

Aziz, Ikmal Hakem A., primary, Abdullah, Mohd Mustafa Al Bakri, additional, Razak, Rafiza Abd, additional, Yahya, Zarina, additional, Salleh, Mohd Arif Anuar Mohd, additional, Chaiprapa, Jitrin, additional, Rojviriya, Catleya, additional, Vizureanu, Petrica, additional, Sandu, Andrei Victor, additional, Tahir, Muhammad FaheemMohd, additional, Abdullah, Alida, additional, and Jamaludin, Liyana, additional

Published
2023
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16. A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY.

Author

ZAIMI, NUR SYAHIRAH MOHAMAD, SALLEH, MOHD ARIF ANUAR MOHD, AL BAKRI ABDULLAH, MOHD MUSTAFA, and RAMLI, MOHD IZRUL IZWAN

Subjects
*LEAD-free solder, *SOLDER & soldering, *THERMAL properties, *ANTIMONY, *TIN alloys, *INTERMETALLIC compounds
Abstract

For long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. It is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. However, Pb is very toxic and Pb usage poses risk to human health and environments. Owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. These factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. The major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. Thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties. [ABSTRACT FROM AUTHOR]

Published
2023
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17. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

Author

Roduan, Siti Faqihah, primary, Wahab, Juyana A., additional, Salleh, Mohd Arif Anuar Mohd, additional, Mahayuddin, Nurul Aida Husna Mohd, additional, Abdullah, Mohd Mustafa Al Bakri, additional, Halil, Aiman Bin Mohd, additional, Zaifuddin, Amira Qistina Syamimi, additional, Muhammad, Mahadzir Ishak, additional, Sandu, Andrei Victor, additional, Baltatu, Mădălina Simona, additional, and Vizureanu, Petrica, additional

Published
2022
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18. Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cell

Author

Magiswaran, Kaiswariah, primary, Norizan, Mohd Natashah, additional, Mahmed, Norsuria, additional, Mohamad, Ili Salwani, additional, Idris, Siti Norhafizah, additional, Sabri, Mohd Faizul Mohd, additional, Amin, Nowshad, additional, Sandu, Andrei Victor, additional, Vizureanu, Petrica, additional, Nabiałek, Marcin, additional, and Salleh, Mohd Arif Anuar Mohd, additional

Published
2022
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19. Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor

Author

Selvan, Mark, primary, Abdul Aziz, Mohd Sharizal, additional, Salleh, Mohd Arif Anuar Mohd, additional, Sharif, Nurulakmal Mohd, additional, Khor, Chu Yee, additional, Ong, Heng Pin, additional, Zainol, Mohd Remy Rozaini Mohd Arif, additional, Vizureanu, Petrica, additional, Burduhos-Nergis, Diana-Petronela, additional, and Sandu, Andrei Victor, additional

Published
2022
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20. Enhancement of Power Conversion Efficiency with Zinc Oxide as Photoanode and Cyanococcus, Punica granatum L., and Vitis vinifera as Natural Fruit Dyes for Dye-Sensitized Solar Cells

Author

Mohamad, Ili Salwani, primary, Norizan, Mohd Natashah, additional, Mahmed, Norsuria, additional, Jamalullail, Nurnaeimah, additional, Halin, Dewi Suriyani Che, additional, Salleh, Mohd Arif Anuar Mohd, additional, Sandu, Andrei Victor, additional, Baltatu, Madalina Simona, additional, and Vizureanu, Petrica, additional

Published
2022
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21. Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.

Author

Amli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Aziz, Mohd Sharizal Abdul, Yasuda, Hideyuki, Nogita, Kazuhiro, Abdullah, Mohd Mustafa Al Bakri, Nemes, Ovidiu, Sandu, Andrei Victor, and Vizureanu, Petrica

Subjects
*SOLDER joints, *SOLDER & soldering, *FINITE element method, *FOOD preservatives, *INTERMETALLIC compounds, *SURFACE finishing, *COPPER
Abstract

The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid–liquid–solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints. [ABSTRACT FROM AUTHOR]

Published
2023
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22. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Author

Zaimi, Nur Syahirah Mohamad, primary, Salleh, Mohd Arif Anuar Mohd, additional, Abdullah, Mohd Mustafa Al-Bakri, additional, Nadzri, Nur Izzati Muhammad, additional, Sandu, Andrei Victor, additional, Vizureanu, Petrica, additional, Ramli, Mohd Izrul Izwan, additional, Nogita, Kazuhiro, additional, Yasuda, Hideyuki, additional, and Sandu, Ioan Gabriel, additional

Published
2022
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23. The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic

Author

Ramli, Mohd Izrul Izwan, primary, Salleh, Mohd Arif Anuar Mohd, additional, Abdullah, Mohd Mustafa Al Bakri, additional, Aziz, Ikmal Hakem, additional, Ying, Tan Chi, additional, Shahedan, Noor Fifinatasha, additional, Kockelmann, Winfried, additional, Fedrigo, Anna, additional, Sandu, Andrei Victor, additional, Vizureanu, Petrica, additional, Chaiprapa, Jitrin, additional, and Burduhos Nergis, Dumitru Doru, additional

Published
2022
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24. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.

Author

Roduan, Siti Faqihah, Wahab, Juyana A., Salleh, Mohd Arif Anuar Mohd, Mahayuddin, Nurul Aida Husna Mohd, Abdullah, Mohd Mustafa Al Bakri, Halil, Aiman Bin Mohd, Zaifuddin, Amira Qistina Syamimi, Muhammad, Mahadzir Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, and Vizureanu, Petrica

Subjects
SOLDER & soldering, SOLDER joints, COPPER, LEAD-free solder, INTERMETALLIC compounds, COPPER-tin alloys, TIN alloys
Abstract

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints' wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples' depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints' average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart. [ABSTRACT FROM AUTHOR]

Published
2023
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25. Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cell.

Author

Magiswaran, Kaiswariah, Norizan, Mohd Natashah, Mahmed, Norsuria, Mohamad, Ili Salwani, Idris, Siti Norhafizah, Sabri, Mohd Faizul Mohd, Amin, Nowshad, Sandu, Andrei Victor, Vizureanu, Petrica, Nabiałek, Marcin, and Salleh, Mohd Arif Anuar Mohd

Subjects
DYE-sensitized solar cells, ZINC oxide, SEMICONDUCTOR films, PHOTOVOLTAIC effect, ZINC oxide films, ELECTRICAL energy
Abstract

Dye-sensitized solar cells (DSSCs) were developed by exploiting the photovoltaic effect to convert solar energy into electrical energy. The photoanode layer thickness significantly affects the semiconductor film's ability to carry electronic charges, adsorb sensitizing dye molecules, and lower the recombination of photo-excited electrons injected into the semiconductor. This study investigated the dependence of the zinc oxide (ZnO) photoanode thin-film thickness and the film soaking time in N719 dye on the photocurrent–voltage characteristics. The ZnO photoanode was applied to glass using the doctor blade method. The thickness was varied by changing the scotch tape layers. The ZnO-based DSSC attained an efficiency of 2.77% with three-layered photoanodes soaked in the dye for three hours, compared to a maximum efficiency of 0.68% that was achieved with three cycles using the dip-coating method in other research. The layer thickness of the ZnO photoanode and its optimal adsorption time for the dye are important parameters that determine the efficiency of the DSSC. Therefore, this work provides important insights to further improve the performance of DSSCs. [ABSTRACT FROM AUTHOR]

Published
2023
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26. Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor.

Author

Selvan, Mark, Abdul Aziz, Mohd Sharizal, Salleh, Mohd Arif Anuar Mohd, Sharif, Nurulakmal Mohd, Khor, Chu Yee, Ong, Heng Pin, Zainol, Mohd Remy Rozaini Mohd Arif, Vizureanu, Petrica, Burduhos-Nergis, Diana-Petronela, and Sandu, Andrei Victor

Subjects
HEAT sinks, NUSSELT number, ENTHALPY, FINS (Engineering), SURFACE coatings, HEAT transfer
Abstract

This paper studies the fin thickness variation effect on a bus duct conductor's thermal performance and the nanocomposite coating method selection for the bus duct conductor's heat sink. ANSYS FLUENT was used to create a numerical model resembling the experimental setup. The IEC 60439-1 and IEC 60439-2 standards were used to benchmark the experimental data. The results revealed that the "chimney effect" induces an increment of the hot air adjacent to the heat sink. A conspicuous increase in the total heat transfer rate and fin effectiveness was observed as the fin thickness was reduced. This study revealed that s1 = 1 mm was the best fin thickness with 1.254 fin effectiveness, 1.862 W of total heat transfer rate, and 17.5 Nusselt number. Additionally, various coating methods were examined experimentally to select the best nanocomposite coating for the bus duct conductor's heat sink. The ultrasonic agitation was the best coating method, which resulted in the lowest average resistance (8.8 μΩ) and a better percentage of Ag (0.6%–2.5%) on the substrate surface. Thus, the current outcomes are expected to better comprehend the impact of fin thickness on thermal performance, as well as the selection of coating method for the bus duct conductor. [ABSTRACT FROM AUTHOR]

Published
2023
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28. Contribution of Interfacial Bonding towards Geopolymers Properties in Geopolymers Reinforced Fibers: A Review

Author

Yazid, Muhd Hafizuddin, primary, Faris, Meor Ahmad, additional, Abdullah, Mohd Mustafa Al Bakri, additional, Nabiałek, Marcin, additional, Rahim, Shayfull Zamree Abd, additional, Salleh, Mohd Arif Anuar Mohd, additional, Kheimi, Marwan, additional, Sandu, Andrei Victor, additional, Rylski, Adam, additional, and Jeż, Bartłomiej, additional

Published
2022
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31. List of contributors

Author

Abdila, Syafiadi Rizki, Abdullah, Mohd Mustafa Al Bakri, Adnan, Muhammad Adam, Agustini, Ni Komang Ayu, Ahmad, Romisuhani, Apandi, Nazirah Mohd, Ariffin, Mohd Azreen Mohd, Awalluddin, Dinie, Darmawan, Vertic Eridani Budi, Deraman, Lailamardiah, Embong, Rahimah, Faris, Meor Ahmad, Ghazali, Che Mohd Ruzaidi, Ghazali, Mohd Fathullah, Hadibarata, Tony, Hafiz, Muhammad Izzul, Hao, Dickson Ling Chuan, Hashim, Mohammad Firdaus Abu, Ibrahim, Masdiyana, Ibrahim, Wan Mastura Wan, Jamaludin, Liyana, Jamel, Aqmal Hidayat, Jusoh, Muhammad Noor Hazwan, Kumar, Jitendra Singh, Kusbiantoro, Andri, Lee, Han-Seung, Ming, Liew Yun, Mohamed, Rosnita, Mohd Hasan, Mohd Rosli, Mohd Tahir, Muhammad Faheem, Mortar, Nurul Aida Mohd, Mustapa, Nur Bahijah, Norain, Maisarah Nur, Rahim, Abdul Muiz Abd, Rahim, Shayfull Zamree Abd, Rashid, Azrin Hani Abdul, Razak, Rafiza Abd, Salleh, Mohd Arif Anuar Mohd, Sauffi, Ahmad Syauqi, Shahedan, Noor Fifinatasha, Sinarta, I. Nengah, Sofri, Liyana Ahmad, Tajudin, Meor Ahmad Faris Meor Ahmad, Tanyildizi, Harun, Yahya, Zarina, Zailani, Warid Wazien Ahmad, and Zamri, Nor Fazlin

Published
2025
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32. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

Author

Ramli, Mohd Izrul Izwan, primary, Salleh, Mohd Arif Anuar Mohd, additional, Sandu, Andrei Victor, additional, Amli, Siti Farahnabilah Muhd, additional, Said, Rita Mohd, additional, Saud, Norainiza, additional, Abdullah, Mohd Mustafa Al Bakri, additional, Vizureanu, Petrica, additional, Rylski, Adam, additional, Chaiprapa, Jitrin, additional, and Nabialek, Marcin, additional

Published
2021
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35. Influence of Sintering Temperature of Kaolin, Slag, and Fly Ash Geopolymers on the Microstructure, Phase Analysis, and Electrical Conductivity

Author

Zulkifli, Nur Nadiah Izzati, primary, Abdullah, Mohd Mustafa Al Bakri, additional, Przybył, Anna, additional, Pietrusiewicz, Paweł, additional, Salleh, Mohd Arif Anuar Mohd, additional, Aziz, Ikmal Hakem, additional, Kwiatkowski, Dariusz, additional, Gacek, Marcin, additional, Gucwa, Marek, additional, and Chaiprapa, Jitrin, additional

Published
2021
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37. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Author

Zaimi, Nur Syahirah Mohamad, primary, Salleh, Mohd Arif Anuar Mohd, additional, Sandu, Andrei Victor, additional, Abdullah, Mohd Mustafa Al Bakri, additional, Saud, Norainiza, additional, Rahim, Shayfull Zamree Abd, additional, Vizureanu, Petrica, additional, Said, Rita Mohd, additional, and Ramli, Mohd Izrul Izwan, additional

Published
2021
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47. Effect of graphene oxide on microstructure and optical properties of TiO2 thin film

Author

Azani, Azliza, primary, Halin, Dewi Suriyani Che, additional, Razak, Kamrosni Abdul, additional, Abdullah, Mohd Mustafa Al Bakri, additional, Salleh, Mohd Arif Anuar Mohd, additional, Razak, Mohd Fairul Sharin Abdul, additional, Mahmed, Norsuria, additional, Ramli, Muhammad Mahyiddin, additional, Azhari, Ayu Wazira, additional, and Chobpattana, V, additional

Published
2019
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