49 results on '"Saib, Mohamed"'
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2. Advanced characterization of 2D materials using SEM image processing and machine learning
3. Cu pad surface height evaluation technique by in-line SEM for wafer hybrid bonding
4. Advanced characterization of 2D materials using SEM image processing and machine learning
5. Frequency-informed deep-learning denoising method supporting sub-nm metrology for high NA EUV lithography
6. 300mm in-line metrologies for the characterization of ultra-thin layer of 2D materials
7. PSF calibration patterns selection based on sensitivity analysis
8. Metrology of thin resist for high NA EUVL
9. Regularized autoencoder for the analysis of multivariate metrology data
10. Chemically amplified resist CDSEM metrology exploration for high NA EUV lithography
11. Printability and propagation of stochastic defects through a study of defects programmed on EUV mask
12. Impact of the buried oxide thickness in UV laser heated 3D stacks
13. Frequency-informed deep-learning denoising method supporting sub-nm metrology for high NA EUV lithography
14. Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology
15. Multivariate analysis methodology for the study of massive multidimensional SEM data
16. (Invited) Metrology Along the Gate-All-Around Logic Roadmap: From Nanosheet to Complementary Field-Effect Transistors.
17. Machine learning for predictive electrical performance using OCD (Erratum)
18. Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications
19. Scatterometry and AFM measurement combination for area selective deposition process characterization
20. Regularized autoencoder for the analysis of multivariate metrology data
21. Metrology of thin resist for high NA EUVL
22. Printability and propagation of stochastic defects through a study of defects programmed on EUV mask
23. 300 mm Wafer Development for Pattern Collapse Evaluations
24. Review-SEM image analysis with K-means algorithm: AM: Advanced metrology/DI: Defect inspection
25. Multivariate analysis methodology for the study of massive multidimensional SEM data
26. Scatterometry and AFM measurement combination for Area Selective Deposition process characterization.
27. Localized Power Spectral Density analysis on Atomic Force Microscopy images for Advanced Patterning applications.
28. Machine learning for predictive electrical performance using OCD.
29. Improvement of Electron Beam Lithography modeling for overdose exposures by using Dill transformation
30. Complete data preparation flow for Massively Parallel E-Beam lithography on 28nm node full-field design
31. Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications
32. Scatterometry and AFM measurement combination for area selective deposition process characterization
33. Machine learning for predictive electrical performance using OCD
34. Mask process matching using a model based data preparation solution
35. Sensitivity analysis for high accuracy proximity effect correction
36. Metrology variability and its impact in process modeling
37. Advanced module for model parameter extraction using global optimization and sensitivity analysis for electron beam proximity effect correction
38. Disturbance Effects in Extreme Ultraviolet Interferometric Lithography Affecting Interference Fringes
39. Regularized autoencoder for the analysis of multivariate metrology data.
40. Metrology of thin resist for high NA EUVL.
41. Mask process matching using a model based data preparation solution
42. Printability and propagation of stochastic defects through a study of defects programmed on EUV mask.
43. Multivariate analysis methodology for the study of massive multidimensional SEM data.
44. Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology.
45. Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology
46. Improvement of Electron Beam Lithography modeling for overdose exposures by using Dill transformation
47. Complete data preparation flow for Massively Parallel E-Beam lithography on 28nm node full-field design
48. Sensitivity analysis for high accuracy proximity effect correction
49. Metrology variability and its impact in process modeling
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