195 results on '"Rzepka, S."'
Search Results
2. Determining adhesion of critical interfaces in microelectronics – A reverse Finite Element Modelling approach based on nanoindentation
3. Reliability of IoT Sensor Systems: New Methods for the Efficient and Comprehensive Reliability Assessment
4. Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
5. Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
6. Reliability of IoT Sensor Systems: New Methods for the Efficient and Comprehensive Reliability Assessment
7. Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
8. Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
9. Stress analyses of high spatial resolution on TSV and BEoL structures
10. Stress impact of moisture diffusion measured with the stress chip
11. On the crack and delamination risk optimization of a Si-interposer for LED packaging
12. Effect of moisture swelling on MEMS packaging and integrated sensors
13. Hybridization of Cooled Mosaic Sensors by Indium-Bumps
14. Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping
15. Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
16. The H2020-ECSEL Project 'iRe140' (Intelligent Reliability 4.0)
17. Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors
18. Transport processes through track-etch membrane filters in a reagent delivery cell
19. PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
20. Determining adhesion of critical interfaces in microelectronics – a reverse Finite Element Modelling approach based on nanoindentation – Part I
21. Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
22. The effect of underfill and underfill delamination on the thermal stress in flip-chip solder joints
23. Adhesive stabilised and pure flip chips on various substrates under thermocycling
24. Time-independent elastic–plastic behaviour of solder materials
25. “3rd Level” Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
26. Stress Analyses in HPC-Soldered Assemblies by Optical Measurement and FEA
27. Long-term thermal fatigue testing of solder joints and related fatigue life predictions
28. Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
29. On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
30. Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
31. Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
32. Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
33. FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
34. Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
35. Robust design optimization: On methodology and short review
36. Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
37. Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
38. Grabungsvorberichte/Preliminary Excavation Reports: Tell el-Retaba, Polish-Slovak Mission. From Hyksos Settlers to Ottoman Pipe Smokers. Tell el-Retaba 2014. Ägypten und Levante|Ägypten und Levante XXV 25
39. Tell el-Retaba from the Second Intermediate Period till the Late Period. Results of the Polish–Slovak Archaeological Mission, Seasons 2011–2012. Ägypten und Levante|Ägypten und Levante XXIV 24
40. Egyptian Mission Rescue Excavations in Tell el-Retaba. Part 1: New Kingdom Remains . Ägypten und Levante|Ägypten und Levante XXII/XXIII 22-23
41. Brittle fracture and damage in bond pad stacks — A study of parameter influences in coupled XFEM and delamination simulation of nanoindentation
42. Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
43. Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment
44. Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
45. Grabungsvorberichte/Preliminary Excavation Reports: Tell el-Retaba, Polish-Slovak Mission. From Hyksos Settlers to Ottoman Pipe Smokers. Tell el-Retaba 2014
46. Grabungsvorberichte/Preliminary Excavation Reports: Tell el-Retaba, Polish-Slovak Mission. From Hyksos Settlers to Ottoman Pipe Smokers. Tell el-Retaba 2014. Ägypten und Levante|Ägypten und Levante XXV 25
47. New Kingdom and the Third Intermediate Period in Tell el-Retaba. Ägypten und Levante|Ägypten und Levante XXI 21
48. Battery management network for fully electrical vehicles featuring smart systems at cell and pack level
49. Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB — A numerical and experimental study
50. Tell el-Retaba 2007–2008. Ägypten und Levante|Ägypten und Levante XIX 19
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