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Double Side SiP is hot packaging solution by using double side SMT technology and dual side molding to shrink the overall module size. The calculation of package size can be reduce over 40% PCB placement area from 8 x 8mm to 6 x 6mm. Based on module level warpage and thermal dissipation performance point of view, the simulation and experiment including the molding process study with difference molding compound selection DOE to verify Double Side SiP warpage performance. The advantage of Double Side SiP, simplify PKG I/O Count (10% reduction based on PMIC of portable), to improve power supply efficiency and reduce noise emission. From electrical integration point of view, due to shorter signal transmission path to get good electrical performance (SI & PI) than other side by side flip chip base structure. From thermal performance, high thermal solution can be improved $\mathrm{24}\sim \mathrm{38}\%$ . The Double Side SiP module can provide an advanced solution to address the module size, cost, performance, and time-to-market requirement for 5G and IoT marketing. The performance verification in this paper will proceed simulation and measurement. The reliability testing verification was including the TCT, HTSL and u-HAST (Temperature Cycle Test, High Temperature Storage Test, un-bias HAST) results as a verification for Double Side SiP structure. Finally, this paper have Double Side SiP structure and feasibility data for future 5G and IoT devices application.

5G era is coming, mobile devices with high performance and high duration ability have been common requirement in recent years. By shrinking PCB size to enlarge battery size seems like a simple way. However, there will be more and more components integrated into a smartphone devices so IC packaging would require the feature of small form factor with integrating inductors, capacitors and resistors into a single module. Today, an emerging 3D packaging solution aka Double-Sided-SiP could offer higher integration ability as well as addressing space limitation.In this paper, a double side molding process will be used forming the Double-Sided-SiP structure which integrates lots passive components on the top side of Double-Sided-SiP are assembled by SMT, and SoC die on the bottom side is surrounded by BGA ball and epoxy molding compound. This kind of packaging platforms are able to shrink overall package size around 35%. However, to provide sufficient related current and voltage usually use bulky passives for this kind of applications. It means that top mold must be tall enough to accommodate the bulky passives. With overall package height constraints, an extremely unbalanced mold ratio between top mold and bottom mold is expected to cause worse warpage performance. Another major challenge is to make BGA ball solder protrusion for sufficient stand of height proceeding to SMT assembly process.In this study theme, warpage simulation for strip form and package unit form will be implemented for epoxy molding compound selection. Afterward, using DOE (Design of Experiment) study to verify warpage performance post molding will be implemented. Another DOE study to find out proper laser ablation process parameter will be performed to reach designate BGA ball solder protrusion as well. In addition, a series typical reliability testing, including TCT(Temperature Cycle Test), HTST(High Temperature Storage Test), un-bias HAST are eventually carried out as verification of the Double-Sided-SiP structure.

The 5G revolution have brought about the huge impact for the communication industry which produces a series of innovative technologies, such as Sub 6Ghz and millimmeter wave (mmWave) 28Ghz spectrum, beam forming, multiconnectivity and edge computing are widely applied in the 5G generation for high speed data transmission and low latency purpose. Furthermore, system in package (SiP) module design and assembly technology plays an key role in IOT, antenna in package (AiP) and RF module applicatons, compare to the tranditional SiP design, the Electromagnetic Interference (EMI) shielding technology is the important factor to influence the shielding effectiveness (SE). In this paper, the EMI coating and partition technology in SiP module will be discussed and analyzed in comformal and compartment shielding methold individually.In this study, Test Veihcle is designed with RF module with EMI shielding and partition technology. In the first part, the various sputter coating material and thickness are demonstrated by Near-Field Scanner meathold, compare to the conventional Cu coating layer, the Cu/Ferrite coating layer have improved about 10 dB SE at 6Ghz high frequency and 30 dB SE at 3MHz low frequency range sucessfully. In addition, the comparison between metal frame and epoxy paste partition shieldig capability resutls are discussed as well in this paper. Thus, the fillng material of metal frame, paste epoxy and SUS+Cu are demonstrated 40 dB SE improvement at 28GHz mmWave frequency by vector network analyzer (VNA) measurement. All of above physical phenomenon will be discussed in detail in the following sections.Finally, the reliability verification of EMI shielding on advanced SiP module will utilize standard JEDEC test condition including Temperature Cycle Test (TCT), High Temperature Storage (HTS), unbias-high accelerated stress test (u-HAST) results to verify the package structure. By employing this SiP structure with EMI shielding technology, the Shielding effectiveness (SE) are improved obviusly in both comformal and compartment structure. Undoubtedly, SiP with EMI shielding structure is absolutely the most innovative technology in the 5G generation.

Recently, the high growing semiconductor is the Internet of Things (IoT) and fifth generation (5G) connectivity application. Based on 5G, the different working frequency between sub 6GHz and millimeter wave (mmWave) frequency range on 28GHz and 39GHz, both systems provide good networking coverage in the city. The mmWave antenna is designed by array antenna to beamforming the Radio frequency signal to the networking devices to achieve high speed data transmission requirement. The system in package (SiP) could integrate various heterogeneous components such as antenna in package (AiP) to get small form factor and high electrical performance. The electromagnetic interference (EMI) is very critical which can damage electronic devices and equipment. To meet the high frequency of electrical performancents, the partition EMI shielding has provided the signal isolation between different function blocks such as digital, analog and RF antenna devices in SiP module. In this paper, a test vehicle is designed to evaluate the shielding effectiveness (SE) by vector network analyzer (VNA). The different partition EMI shielding method and study will proceed and measure under mmWave frequency of 22GHz to 40GHz. The reliability verification of EMI shielding on advanced SiP module will utilize standard JEDEC test condition including Temperature Cycle Test (TCT), High Temperature Storage (HTS), unbias-high accelerated stress test (u-HAST) results to verify the package structure. Finally, this paper will demonstrate the advanced SiP with EMI shielding solutions for future 5G Connectivity devices application.

Along with the rapid spread of portable electronic products on the mobile computing market, the increase in the use of video streaming, photo sharing and also other data-intensive applications keep growing up continuously for now. More and more IoT/Wearable and 5G connectivity devices are required with Radio Frequency (RF) and Front-End Module (FEM) which has driven the development of IC packaging towards on small form factor, thin profile, better electrical and thermal performance, as well as 3D stacking for multi-function integration [1]. To approach these requirements, the System in Package (SiP) can be a combination of one or more chips plus optionally passive components by using Surface Mount Technology (SMT) and 3D structure of double side into a single package to offer a small form factor, high performance and systemization implemented. The high speed SMT process accomplishes the high-density with more than 50 discrete passive as well as active components and heterogeneous integration on package level approach. The development of double side technology offers the advantage of package size shrinkage by the same integrating discrete passive and active components layout. In this paper, the innovative packaging solutions of 3D double side SiP including the platform for both strip form of substrate base and wafer form of Fan-Out Redistribution Layer (RDL) base will be well introduced. Fan-Out RDL is an extension approach of Wafer Level Chip Scale Package (WLCSP), this technology is different from conventional wire bond or flip chip packages because the redistribution dielectrics and fine-line plated conductors are used for interconnection to replace the packaging substrates. As a case study, the calculation of 3D SiP package size can be shrunk around 50% area and the total package thickness can achieve around 15% z-height reduction with thin form coreless substrate and Fan-Out RDL technology utilization. The characterization analysis will apply simulation methodology for electrical comparison on DC resistance and parasitic inductance, thermal comparison on Theta JA (°C/W) and warpage comparison on the package structure of 3D double side SiP. Also, the typical reliability testing (Temperature Cycle Test, High Temperature Storage Life Test, Unbiased High Accelerated Stress Test) are built to verify 3D double side SiP structure for future IoT/Wearable and 5G devices application. Currently the market trends clearly drive towards 3D double side SiP, so this article illustrates the innovative packaging solutions with both substrate base and Fan-Out RDL base to provide a unique opportunity for enabling 3D integration and system in package.

Recently, the coming fast and large growing opportunity market will be the Internet of Things (IoT) and fifth generation (5G) connectivity application. Particularly for 5G, need to design by beamforming antennas to send Radio Frequency (RF) signals to different network & client devices. By using MIMO (Multi-Input Multi-Out) technology which uses more transmitters and receivers to ensure each antenna of data transmission performance. To meet those new application requirements & challenges, high-gain antennas have been proposedfor wireless connectivity products such as high data transmission, very low latency and low power consumption requirements. A 3D System in Package (3DSiP) including different approach, such as the double side assembly technology and antenna in package (AiP) which is a combination solutions for these requirements. In this paper, SPIL provided an alternative 3D antenna SiP technologu which used surface mount technology (SMT) and 3D antenna integration were designed to shrink the package size, the calculation of package size can be shrunk around 55% area andpackage size reducedfrom 10 x8mm to 6x6mm. This new solution could be integrated an antenna inside SiP module as AiP technology to get smallform factor and additional major benefites to address cost, performance, and time-to-market. The characterization analysis will utilize typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, unbias HAST) results and verify the package structure. Finally, this paper will find out the suitable 3DSiP with advanced antenna integration solution forfuture IoT and 5G Connectivity devices application.

Recently, based on next generation wireless connectivity system evolution, there are more and more components combined into smartphone of Radio Frequency (RF) and Front-End Module (FEM) for up-coming 5G application. Also, the Internet of Things (IoT) continue to grow up due to the electronics industry is moved maturely on the mobile computing market for now. Both of IoT and 5G connectivity devices are required small form factor and high thermal performance. A 3D System in Package (3D SiP) including different approach, such as the double side molding technology and antenna in package (AiP) which is a combination solutions for these requirements. In this paper, the 3D SiP package platform will use dual side Surface Mount Technology (SMT) technology and 3D structure of double side molding to shrink overall package size of 3D SiP module. The calculation of package size can be shrunk around 60% area, package size can be reduced from 8 x 8mm to 6 x 6mm. From warpage and thermal performance are proceed simulation and measurement. And experiment including the DOE (Design of Experiment) study for molding process with different high thermal epoxy molding compound (EMC) selection to verify warpage performance. By utilizing advanced package structure solutions such as high speed SMT placement, Cu substrate with thermal pad for high thermal, double side molding, a 3D double side SiP module can provide a unique opportunity to address cost, performance, and time-to-market. Considering the limitations of power consumption and form factor, smart phone front end module will become the major requirements for SiP platforms. The characterization analysis will utilize simulation methodology and measurement correction for warpage and thermal performance comparison. Also, will proceed the typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, un-bias HAST) results as a verification for 3D double side SiP structure. Finally, this paper will find out the suitable 3D SiP structure and feasibility data for future IoT and 5G devices application.

BACKGROUND Over the past decade, extracorporeal mechanical support (ECMO) has been increasingly utilized in respiratory failure and cardiogenic shock. There is a need for assessing clinical and financial outcomes of ECMO use. This study presents our institution's experience with veno-arterial ECMO (VA-ECMO) over a 9-year period. METHODS A retrospective review of our institution's ECMO database identified patients undergoing VA-ECMO between 2005 and 2013 (N = 150). Patients were assigned to four groups by indication: post-cardiotomy syndrome, cardiogenic shock requiring cardiopulmonary resuscitation (CPR), cardiogenic shock not requiring CPR, and respiratory failure. Hospital charges from administrative records were analyzed. Trend and correlation analyses were used to evaluate clinical and financial outcomes. RESULTS Of the 150 patients meeting inclusion criteria, 28% required VA-ECMO for post-cardiotomy syndrome, 31.3% for cardiogenic shock with CPR, 35.3% for cadiogenic shock with no CPR, and 5.4% for respiratory failure. Mean duration on ECMO was 5.0 ± 3.4 days with a survival rate of 64% and no difference between the four groups (p = 0.40). ECMO-associated charges averaged $74,500 ± 61,400 per patient, 6% of total hospital charges. Subgroup analysis of cardiogenic shock patients revealed a nearly twofold increase in ECMO-related charges among patients who did not receive CPR (p = 0.04), as well as a trend toward improved survival (69.8% vs 51.1%, p = 0.06). CONCLUSION In view of the variations in survival and costs in ECMO patients, further studies should aim to delineate patient populations that benefit from early initiation of ECMO.

What went wrong? Why did seemingly rational bond investors continue to purchase Puerto Rican debt with only a modest risk premium, even though the macroeconomic fundamentals were dismal? Why did financial markets fail to exercise market discipline and restrict capital flows to Puerto Rico? Given gloomy macroeconomic fundamentals and relatively low risk premia, investors were either stunningly myopic/misinformed, or Puerto Rican debt was implicitly insured by the U.S. government. This paper examines the latter hypothesis, which we label the “Treasury Put.” The expectation of a federal bailout was perfectly reasonable given past behavior by the federal government, starting with the prior bailout of the city of New York. Evaluating the Treasury Put hypothesis with a minimal set of assumptions is possible given three unique features – the dire fiscal and economic conditions in Puerto Rico, a fortunate characteristic of Puerto Rican bond issuance, and a “seismic shock.” Regarding the second feature, Puerto Rico issued both uninsured and insured general obligation bonds on the same day and, in many cases, with the exact same maturity. The associated bond price data allow for an accurate computation of the risk premia on Puerto Rican bonds. The third feature is the non-bailout of the city of Detroit in 2013 that effectively extinguished the Treasury Put. Puerto Rican risk premia were stable before the Detroit bankruptcy and bracketed by the risk premia on Corporate Aaa and Baa bonds. However, after the Detroit bankruptcy, risk premia rose dramatically, thus identifying a sizeable Treasury Put of at least 300 basis points and a significant misallocation of capital to Puerto Rico. In effect, the Treasury Put was a form of regulatory forbearance. Institutional reforms that would eliminate the Treasury Put are considered, but none are found satisfactory.

In the near future, the next potential fast and large growing opportunity market will be the Internet of Things (IoT) and fifth generation (5G) connectivity application, due to the electronics industry is moved maturely on the mobile computing market for now. To meet the new application requirements & challenges, high-gain antennas have been proposed for wireless connectivity applications such as IoT and 5G product for high data transmission and low power consumption requirements. Differemt frequency transmission required to integrate an antenna in SiP module so that product designer can develop the products as compact as possible for specific application. This advanced technology will provide the integration solution for small form factor, high electrical performance, multi-function and low cost were the most popular requirements, the System in Package (SiP) is a combination of heterogeneous idea with semiconductor devices and passive components within one small package as system function module.In this paper, SPIL provided an alternative 3D small form factor SiP methodology will use surface mount technology (SMT) and 3D structure of stacking die on passives with antenna integration were designed to shrink the package size, the calculation of package size can be shrunk around 25% area and package size reduced from 16 x 12mm to 12 ×12mm. This new solution could be integrated an antenna inside SiP module as antenna in package (AiP) technology to get small form factor and additional major benefites to address cost, performance, and time-to-market.The characterization analysis will utilize typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, unbias HAST) results as a verification for stacking die on passives integrated 3D antenna of SiP feasibility structure. Finally, this paper will find out the suitable 3D stacking die on passives of SiP structure and antenna integration solution for future IoT and 5G Connectivity devices application.

Recently, the electronics industry is moved maturely on the mobile/tablet market. The next fast growing opportunity market will be the Internet of Things (IoT) and Wearable Deivces in the near future. This advanced technology/package need to provide the ideal solution for small form factor, thin profile, high electrical performance, multi-function integration and low cost are the most critical requirements. To approach these requirements, the System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a small package, mounted onto the system's main board assembly. SiP can be integrated multi-function chips into a single package and offer a small form factor and a low cost system solution for many wireless connectivity applications. In this paper, an alternative 3D small form factor SiP methodology will use surface mount technology (SMT) and 3D structure of stacking die on passives to shrink the package size. The calculation of package size can be shrunk around 25% area and package size reduced from 11.5 × 11.5mm to 10x10mm. For the experiment including the DOE (Design of Experiment) study for the passive quantities optimization and also die tilt performance between different passive quantities. By utilizing exiting package solutions (such as wire bond, flip chip, hybrid or stacked die process), a SiP module provide a unique opportunity to address cost, performance, and time-to-market. Considering the limitations of power consumption and form factor, such as Bluetooth Low Energy (BLE), and wireless connectivity module will become the major requirements for SiP platforms in near marketing. The characterization analysis will utilize simulation methodology & typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, unbias HAST) results as a verification for 3D stacking die on passives of SiP feasibility structure. Finally, this paper will find out the suitable 3D stacking die on passives of SiP structure and feasibility data for future IoT and wearable devices application.

Over the past decade, extracorporeal mechanical support (ECMO) has been increasingly utilized in respiratory failure and cardiogenic shock. There is a need for assessing clinical and financial outcomes of ECMO use. This study presents our institution's experience with veno-arterial ECMO (VA-ECMO) over a 9-year period.A retrospective review of our institution's ECMO database identified patients undergoing VA-ECMO between 2005 and 2013 (N = 150). Patients were assigned to four groups by indication: post-cardiotomy syndrome, cardiogenic shock requiring cardiopulmonary resuscitation (CPR), cardiogenic shock not requiring CPR, and respiratory failure. Hospital charges from administrative records were analyzed. Trend and correlation analyses were used to evaluate clinical and financial outcomes.Of the 150 patients meeting inclusion criteria, 28% required VA-ECMO for post-cardiotomy syndrome, 31.3% for cardiogenic shock with CPR, 35.3% for cadiogenic shock with no CPR, and 5.4% for respiratory failure. Mean duration on ECMO was 5.0 ± 3.4 days with a survival rate of 64% and no difference between the four groups (p = 0.40). ECMO-associated charges averaged $74,500 ± 61,400 per patient, 6% of total hospital charges. Subgroup analysis of cardiogenic shock patients revealed a nearly twofold increase in ECMO-related charges among patients who did not receive CPR (p = 0.04), as well as a trend toward improved survival (69.8% vs 51.1%, p = 0.06).In view of the variations in survival and costs in ECMO patients, further studies should aim to delineate patient populations that benefit from early initiation of ECMO.

Antagonism of alphav beta6 is emerging as a potential treatment of idiopathic pulmonary fibrosis based on strong target validation. Starting from an alphav beta3 antagonist lead and through simple variation in the nature and position of aryl substituent, the discovery of compounds with improved alphav beta6 activity is described. The compounds also have physicochemical properties commensurate with oral bioavailability and are high quality starting points for a drug discovery programme. Compounds 33S and 43E1 are pan alphav antagonists having ca 100 nM potency against alphav beta3, alphav beta5, alphav beta6 and alphav beta8 in cell adhesion assays. Detailed structure activity relationships with these integrins are described which also reveal substituents providing partial selectivity (defined as at least a 0.7 log difference in pIC50 values between the integrins in question) for alphav beta3 and alphav beta5.