24 results on '"Renner, F.U."'
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2. Use of pyrophosphate and boric acid additives in the copper-zinc alloy electrodeposition and chemical dealloying
3. Real-time monitoring of interactions between Ebola fusion peptide and solid-supported phospholipid membranes: Effect of peptide concentration and layer geometry
4. Kinetics and crystallization path of a Fe-based metallic glass alloy
5. Lithiation and Delithiation Mechanisms of Gold Thin Film Model Anodes for Lithium Ion Batteries: Electrochemical Characterization
6. Glass-formation and corrosion properties of Fe–Cr–Mo–C–B glassy ribbons with low Cr content
7. Multi-element-resolved electrochemical corrosion analysis. Part I. Dissolution behavior and passivity of amorphous Fe50Cr15Mo14C15B6
8. Crystallization, phase evolution and corrosion of Fe-based metallic glasses: An atomic-scale structural and chemical characterization study
9. Dealloying on the Atomic Scale
10. Corrosion behaviour of Fe–Al(–Ti) alloys in steam
11. Gold model anodes for Li-ion batteries: Single crystalline systems studied by in situ X-ray diffraction
12. In-situ X-ray diffraction study of the initial dealloying of Cu 3Au(001) and Cu 0.83Pd 0.17(001)
13. XPS fast depth profile of the native oxide layers on AISI 304, 316 and 430 commercial stainless steels and their evolution with time
14. Electrochemical growth of copper on well-defined n-Si(1 1 1):H surfaces
15. In situ X-ray analysis of solid/electrolyte interfaces: electrodeposition of Cu and Co on Si(1 1 1):H and GaAs(0 0 1) and corrosion of Cu 3Au(1 1 1)
16. A structure study of the electroless deposition of Au on Si( [formula omitted]):H
17. Dealloying on the Atomic Scale
18. The electrodeposition of copper onto UHV-prepared GaAs(0 0 1) surfaces
19. Dislocation engineering and its effect on the oxidation behaviour
20. The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces
21. The influence of chloride on the initial anodic dissolution of Cu 3Au(1 1 1)
22. In-situ X-ray diffraction study of the initial dealloying of Cu3Au(001) and Cu0.83Pd0.17(001)
23. Electrochemical growth of copper on well-defined n-Si(111):H surfaces
24. In situ X-ray analysis of solid/electrolyte interfaces: electrodeposition of Cu and Co on Si(111):H and GaAs(001) and corrosion of Cu3Au(111)
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