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Mg-doped, graded AlGaN films showed the formation of an impurity band and high, temperature-invariant p-conductivity even for doping levels well below the Mott transition. However, compensating point defects disrupted the impurity band, resulting in an Anderson transition from the impurity band to valence band conduction and a more than tenfold reduction in room-temperature conductivity. This is the first demonstration of Anderson-like localization in AlGaN films. [ABSTRACT FROM AUTHOR]

High room temperature n-type mobility, exceeding 300 cm2/Vs, was demonstrated in Si-doped AlN. Dislocations and CN−1 were identified as the main compensators for AlN grown on sapphire and AlN single crystalline substrates, respectively, limiting the lower doping limit and mobility. Once the dislocation density was reduced by the growth on AlN wafers, C-related compensation could be reduced by controlling the process supersaturation and Fermi level during growth. While the growth on sapphire substrates supported only high doping ([Si] > 5 × 1018 cm−3) and low mobility (∼20 cm2/Vs), growth on AlN with proper compensation management enabled controlled doping at two orders of magnitude lower dopant concentrations. This work is of crucial technological importance because it enables the growth of drift layers for AlN-based power devices. [ABSTRACT FROM AUTHOR]

Limiting buffer layer current leakage is essential for the realization of high breakdown fields in GaN-on-Si high electron mobility transistors (HEMTs). In this report, we demonstrate the importance of controlling the surface morphology of the AlN nucleation layer (NL) in limiting this leakage. Testing on a self-consistent series of samples grown under two different AlN NL conditions revealed the presence of leakage paths within the epilayers grown using a single temperature AlN NL owing to the presence of surface pits. The introduction of a higher temperature AlN in the NL drastically reduced the pit density and led to a large reduction (>103) in the lateral and vertical buffer leakage in HEMT structures. Using conductive atomic force microscopy, secondary ion mass spectroscopy, and temperature-dependent carrier transport measurements, we confirm that these pits—which originate in the AlN NL, thread vertically, and propagate into the device structures—are associated with leakage paths, thus reducing the field that can be dropped across the epilayers. This is explained by invoking preferential oxygen segregation at their side-facets. It is shown that when a pit-free surface is maintained, a vertical field of 1.6 MV/cm can be achieved for HEMTs. This study is expected to benefit the development of high-performance GaN HEMTs in moving toward the theoretical breakdown field of III-nitrides. [ABSTRACT FROM AUTHOR]

We report on the growth of AlN epilayers at reasonably low temperatures of 1050–1110 °C on non-miscut c-plane sapphire by metal organic chemical vapor deposition (MOCVD). A systematic study of growth parameters revealed that the thickness of the low temperature (LT) nucleation layer (NL) plays a critical role in improving the screw and edge dislocation densities and surface morphology of the AlN epilayer. A surface kinetics based physico-chemical model is proposed to optimize the crystalline quality and is found to correlate well to the experimental observations. Using a 7 nm nominally-thick LT NL, a 0.5 μm thick AlN epilayer with an rms roughness of 0.15 nm, and (002) and (102) omega scan widths of 18 arc sec and 970 arc sec, respectively, was realized. A grain coalescence model for stress generation is used to correlate the change in AlN growth stress with variation in the NL thickness, and it is shown that in-situ stress measurement can be employed as an early signature for reproducibility of the crystalline quality. This study suggests that AlN/sapphire templates can potentially be realized for a reasonably low thickness (0.5 μm) and at temperatures as low as 1050 °C, which is accessible by most of the III-nitride MOCVD systems. [ABSTRACT FROM AUTHOR]

Heteroepitaxial crystallographic tilt has been investigated as a possible strain‐relief mechanism in Al‐rich (Al>50%) AlGaN heteroepitaxial layers grown on single‐crystal (0001) AlN substrates with varying miscuts from 0.05° to 4.30°. The magnitude of the elastic lattice deformation‐induced tilt increases monotonically with the miscut angle, tightly following the Nagai tilt model. Although tilt angles as high as 0.1° are recorded, reciprocal space mapping (RSM) broadening and wafer bow measurements do not show any significant changes as a function of the heteroepitaxial tilt angle. While crystallographic tilting has been shown to be effective in controlling strain in some other heteroepitaxial systems, it does not provide any appreciable strain relief of the compressive strain in AlGaN/AlN heteroepitaxy. [ABSTRACT FROM AUTHOR]

We report on the highest responsivity for III-nitride Metal Semiconductor Metal solar-blind photodetectors on sapphire. Devices on unintentionally doped AlGaN epilayers grown by Metal Organic Chemical Vapor Deposition exhibited sharp absorption cut-off in the range of 245-290 nm. Very high responsivity >5 A/W at 10V bias was achieved with visible rejection exceeding three orders of magnitude for front illumination. Compared to the responsivity values reported in the literature for state-of-the-art solar-blind photodetectors, this work presents the highest values of responsivity at a given bias and up to sub-250 nm detection threshold. The high responsivity is attributed to an internal gain mechanism operating on these devices. The reverse-bias leakage current across these samples was found to be dominated by thermionic field emission at low biases and Poole-Frenkel emission from a deep trap level (0.7 eV from the conduction band-edge for Al0.50Ga0.50N) at high biases. [ABSTRACT FROM AUTHOR]

We report on the absence of strain relaxation mechanism in Al0.6Ga0.4N epilayers grown on (0001) AlN substrates for thickness as large as 3.5 μm, three-orders of magnitude beyond the Matthews–Blakeslee critical thickness for the formation of misfit dislocations (MDs). A steady-state compressive stress of 3–4 GPa was observed throughout the AlGaN growth leading to a large lattice bow (a radius of curvature of 0.5 m−1) for the thickest sample. Despite the large lattice mismatch-induced strain energy, the epilayers exhibited a smooth and crack-free surface morphology. These results point to the presence of a large barrier for nucleation of MDs in Al-rich AlGaN epilayers. Compositionally graded AlGaN layers were investigated as potential strain relief layers by the intentional introduction of MDs. While the graded layers abetted MD formation, the inadequate length of these MDs correlated with insignificant strain relaxation. This study emphasizes the importance of developing strain management strategies for the implementation of the single-crystal AlN substrate platform for III-nitride deep-UV optoelectronics and power electronics. [ABSTRACT FROM AUTHOR]

The ultra-wide bandgap of Al-rich AlGaN is expected to support a significantly larger breakdown field compared to GaN, but the reported performance thus far has been limited by the use of foreign substrates. In this Letter, the material and electrical properties of Al0.85Ga0.15N/Al0.6Ga0.4N high electron mobility transistors (HEMT) grown on a 2-in. single crystal AlN substrate are investigated, and it is demonstrated that native AlN substrates unlock the potential for Al-rich AlGaN to sustain large fields in such devices. We further study how Ohmic contacts made directly to a Si-doped channel layer reduce the knee voltage and increase the output current density. High-quality AlGaN growth is confirmed via scanning transmission electron microscopy, which also reveals the absence of metal penetration at the Ohmic contact interface and is in contrast to established GaN HEMT technology. Two-terminal mesa breakdown characteristics with 1.3 μm separation possess a record-high breakdown field strength of ∼11.5 MV/cm for an undoped Al0.6Ga0.4N-channel layer. The breakdown voltages for three-terminal devices measured with gate-drain distances of 4 and 9 μm are 850 and 1500 V, respectively. [ABSTRACT FROM AUTHOR]

In this work, an alternative scheme to estimate the resistivity and ionization energy of Al-rich p-AlGaN epitaxial films is developed using two large-area ohmic contacts. Accordingly, the resistivities measured using currentâ€"voltage measurements were observed to corroborate the Hall measurements in the Van der Pauw configuration. A free hole concentration of ∼1.5 Ă— 1017 cmâˆ'3 and low ionization energy of ∼65 meV in Mg-doped Al0.7Ga0.3N films is demonstrated. Nearly an order of magnitude lower hydrogen concentration than Mg in the as-grown AlGaN films is thought to reduce the Mg passivation and enable higher hole concentrations in Al-rich p-AlGaN films, compared to p-GaN films. The alternate methodology proposed in this work is expected to provide a simpler pathway to evaluate the electrical characteristics of Al-rich p-AlGaN films for future III-nitride ultraviolet light emitters. [ABSTRACT FROM AUTHOR]

Si nanowire growth on sapphire substrates by the vapor-liquid-solid (VLS) method using Au catalyst particles has been studied. Sapphire was chosen as the substrate to ensure that the vapor phase is the only source of Si. Three hitherto unreported observations are described. First, an incubation period of 120-480 s, which is shown to be the incubation period as defined in classical nucleation theory, is reported. This incubation period permits the determination of a desolvation energy of Si from Au-Si alloys of 15 kT. Two, transmission electron microscopy studies of incubation, point to Si loss by reverse reaction as an important part of the mechanism of Si nanowire growth by VLS. Three, calculations using these physico-chemical parameters determined from incubation and measured steady state growth rates of Si nanowires show that wire growth happens from a supersaturated catalyst droplet. [ABSTRACT FROM AUTHOR]