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4. Thermomechanics & Infrared Imaging, Inverse Problem Methodologies, Mechanics of Additive & Advanced Manufactured Materials, and Advancements in Optical Methods & Digital Image Correlation, Volume 4 : Proceedings of the 2021 Annual Conference on Experimental and Applied Mechanics

Author

Sharlotte L.B. Kramer, Rachael Tighe, Ming-Tzer Lin, Cosme Furlong, Chi-Hung Hwang, Sharlotte L.B. Kramer, Rachael Tighe, Ming-Tzer Lin, Cosme Furlong, and Chi-Hung Hwang

Subjects
Mechanics, Applied, Materials—Analysis, Imaging systems, Industrial engineering, Production engineering, Thermodynamics, Heat engineering, Heat transfer, Mass transfer
Abstract

Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, and Advancement of Optical Methods & Digital Image Correlation, Volume 4 of the Proceedings of the 2021 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of four from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Test Design and Inverse Method Algorithms Inverse Problems: Virtual Fields Method Material Characterizations Using Thermography Fatigue, Damage & Fracture Evaluation Using Infrared Thermography Mechanics of Additive & Advanced Manufactured Materials DIC Methods & Its Applications Photoelasticity and Interferometry Applications Micro-Optics and Microscopic Systems Multiscale and New Developments in Optical Methods

Published
2022

5. Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7 : Proceedings of the 2020 Annual Conference on Experimental and Applied Mechanics

Author

Sharlotte L.B. Kramer, Rachael Tighe, Sharlotte L.B. Kramer, and Rachael Tighe

Subjects
Industrial engineering, Production engineering, Engineering design, Materials—Analysis, Mechanics, Applied
Abstract

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:Test Design and Inverse Method AlgorithmsInverse Problems: Virtual Fields MethodResidual Stresses: Measurement, Uncertainty & ValidationResidual Stresses: Eigenvalues, Modeling, & Crack GrowthMaterial Characterizations Using ThermographyFatigue, Damage & Fracture Evaluation Using Infrared Thermography

Published
2021

6. Which Pattern for a Low Pattern-Induced Bias?

Author

Frédéric Sur, Benoît Blaysat, Michel Grédiac, Recalage visuel avec des modèles physiquement réalistes (TANGRAM), Inria Nancy - Grand Est, Institut National de Recherche en Informatique et en Automatique (Inria)-Institut National de Recherche en Informatique et en Automatique (Inria)-Université de Lorraine (UL)-Department of Algorithms, Computation, Image and Geometry (LORIA - ALGO), Laboratoire Lorrain de Recherche en Informatique et ses Applications (LORIA), Institut National de Recherche en Informatique et en Automatique (Inria)-Université de Lorraine (UL)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche en Informatique et en Automatique (Inria)-Université de Lorraine (UL)-Centre National de la Recherche Scientifique (CNRS)-Laboratoire Lorrain de Recherche en Informatique et ses Applications (LORIA), Institut National de Recherche en Informatique et en Automatique (Inria)-Université de Lorraine (UL)-Centre National de la Recherche Scientifique (CNRS)-Centre National de la Recherche Scientifique (CNRS)-Centre National de la Recherche Scientifique (CNRS), Institut Pascal (IP), Centre National de la Recherche Scientifique (CNRS)-Université Clermont Auvergne (UCA)-Institut national polytechnique Clermont Auvergne (INP Clermont Auvergne), Université Clermont Auvergne (UCA)-Université Clermont Auvergne (UCA), Sharlotte L.B. Kramer, Rachael Tighe, Ming-Tzer Lin, Cosme Furlong, and Chi-Hung Hwang

Subjects
[INFO.INFO-TS]Computer Science [cs]/Signal and Image Processing, Checkerboard, Localized spectrum analysis, [SPI.MECA.MEMA]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanics of materials [physics.class-ph], Digital image correlation, Pattern-induced bias, Uncertainty quantification
Abstract

International audience; The first objective of this presentation is to show that it is possible to explain the cause of the pattern-induced bias (PIB) observed in displacement fields obtained by local DIC. A model is presented for this purpose. It gathers the different errors made when retrieving this displacement by minimizing the optical residual over subsets. It is shown that PIB predicted with this model and its counterpart observed with displacement fields obtained with DIC are in good agreement. When DIC is applied on periodic patterns like checkerboards instead of random speckles, it is observed that PIB becomes negligible. Such regular patterns are however not well suited for DIC. Hence it is recalled how to process such images by minimizing the optical residual in the Fourier domain instead of the spatial one. PIB is assessed in this case, and it is also observed that PIB is negligible in displacement maps obtained with such regular patterns processed by minimizing the optical residual in the Fourier domain.

Published
2022
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