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In the frame of green-based chemistry, advanced shape memory polymers are designed from benzoxazine (RSBOX) and epoxy (R-EP) resins basing on potential natural raw materials, such as resorcinol and stearylamine. Thermal curing, investigated by differential scanning calorimetry, shows several overlapping peaks suggesting a complex curing mechanism. Dynamic mechanical analysis of cured RS-BOX/R-EP copolymers demonstrates an increase in the glass temperature and narrower glass transition by the increase of the RS-BOX ratio. In contrast, crosslinking density increases with higher epoxy resin content. All investigated materials possess one-way dual shape memory ability triggered by glass transition temperature with excellent shape fixity, while the shape recovery values ranged between 95 and 100%. The duration of the recovery process is significantly influenced by the RS-BOX amount. Additionally, the mechanical and shape memory properties of fully bio-based SMPs might be suitably tailored for advanced applications by merely varying the initial composition.

Novel epoxy-benzoxazine emulsions designed for water-based coatings were prepared and investigated. Bisphe- nol#A-based epoxy resins with molar weights of 340, 377 and 1750 g/mol along with epoxidized soybean oil were emulsi- fied using mono- and bi-functional benzoxazine surfactants, which are able to react with epoxy resins at their cure temperature. The structure of synthesized surfactants carrying one or two polyether chains was confirmed using Fourier transform infrared spectroscopy, 1 H nuclear magnetic resonance and differential scanning calorimetry. Stability of emul- sions was verified by particle diameters measurements. Coatings, made directly from emulsions, were dried and cured at elevated temperature using 3,3$-dimetoxybenzidine as curing agent to ensure a highly cross-linked structure of thermoset- ting films. Curing process, thermal properties and hardness of cured films were investigated. It was found that benzoxazine molecules were well incorporated into the epoxy network upon curing, which ensures no void structure of cured copolymer and enhanced coating properties.