1. Finite element analysis of the effects of geometry and microstructure on electromigration in confined metal lines
- Author
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Yongkun Liu, Christopher L. Cox, and R. J. Diefendorf
- Subjects
Stress (mechanics) ,Materials science ,Line (geometry) ,General Physics and Astronomy ,Mechanics ,Boundary value problem ,Diffusion (business) ,Microstructure ,Electromigration ,Finite element method ,Conductor - Abstract
A simple mathematical model based on atomic drift and diffusion is advanced to describe electromigration-induced stress in confined metal lines. Using a finite element approach, a MATLAB program was developed to simulate stress evolution in lines with variable geometry and microstructure under different boundary conditions. The simulation results show that the contact pads connected to the line end in the National Institute of Standards and Technology (NIST) test structure postpone the stress buildup in a microstructurally homogeneous line and the time to reach a certain stress is proportional to the pad sizes when the pads are much wider than the line. Subtractive defects are not the preferred failure sites when the defects fall on a wide polycrystalline line or a bamboo structure line. In a narrow polycrystalline conductor with a distribution of grain size, a subtractive defect may result in an abrupt change in the effective diffusion coefficient (blocking effect) along the line and quick buildup of the...
- Published
- 1998