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A pulsed laser annealing method is utilized to directly synthesize nickel silicide (NiSi) as a contact material to improve the contact of electric devices. Three laser wavelengths, 355 nm (ultraviolet laser), 532 nm (green laser), and 1064 nm (infrared laser), are used for the NiSi synthesis during the pulsed laser annealing process. A NiSi phase with low sheet resistance is formed by an ultraviolet laser annealing (ULA) process without damaging the polyimide (PI) substrate. With the integration of the ULA process‐induced NiSi into p‐nnel MOSFET (PMOS) and n‐channel MOSFET (NMOS) devices, the on/off ratio improves significantly, and the field‐effect mobility increases by 30% because of the reduction in contact resistance from 21 to 8.5 kΩ. In addition to the PMOS and NMOS, the gains of the CMOS inverter at different Vdd values are improved by at least 30%. Moreover, the static noise margin of 6T‐SRAM is elevated from 0.82 to 1 V at Vdd = 4 V. The ability of the ULA process to synthesize a high‐quality NiSi layer on a flexible substrate is demonstrated. The integration of NiSi into electrical devices offers a new pathway for improving the electrical behavior of flexible devices. [ABSTRACT FROM AUTHOR]

Abstract A pulsed laser annealing method is utilized to directly synthesize nickel silicide (NiSi) as a contact material to improve the contact of electric devices. Three laser wavelengths, 355 nm (ultraviolet laser), 532 nm (green laser), and 1064 nm (infrared laser), are used for the NiSi synthesis during the pulsed laser annealing process. A NiSi phase with low sheet resistance is formed by an ultraviolet laser annealing (ULA) process without damaging the polyimide (PI) substrate. With the integration of the ULA process‐induced NiSi into p‐nnel MOSFET (PMOS) and n‐channel MOSFET (NMOS) devices, the on/off ratio improves significantly, and the field‐effect mobility increases by 30% because of the reduction in contact resistance from 21 to 8.5 kΩ. In addition to the PMOS and NMOS, the gains of the CMOS inverter at different Vdd values are improved by at least 30%. Moreover, the static noise margin of 6T‐SRAM is elevated from 0.82 to 1 V at Vdd = 4 V. The ability of the ULA process to synthesize a high‐quality NiSi layer on a flexible substrate is demonstrated. The integration of NiSi into electrical devices offers a new pathway for improving the electrical behavior of flexible devices.

Abstract: CuInSe2 (CISe) is a prototype material for the I–III–VI chalcopyrites such as Cu(In,Ga)(S,Se)2 used as absorber layers in thin film photovoltaic cells. Carefully-controlled pulsed-laser annealing (PLA) is a unique annealing process that has been demonstrated to improve the device performance of chalcopyrite solar cells. Here, we investigate the changes in defect populations after PLA of electrochemically-deposited CISe thin films previously furnace annealed in selenium vapor. The films were irradiated in the sub-melting regime at fluences inducing temperatures up to 840±100K. Deep-level transient spectroscopy on Schottky diodes reveals that the activation energy of the dominant majority carrier trap changes non-monotonically from 215±10meV for the reference sample, to 330±10meV for samples irradiated at 20 and 30mJ/cm2, and then back to 215±10meV for samples irradiated at 40mJ/cm2. A hypothesis involving competing processes of diffusion of Cu and laser-induced generation of In vacancies may explain this behavior. [Copyright &y& Elsevier]

In this paper, we demonstrate eliminating the stress gradient in polycrystalline silicon germanium films at temperatures compatible with standard CMOS (AI interconnects) backend processing. First, we study the effect of varying the germanium concentration from 40% to 90%, layer thickness, deposition pressure from 650 to 800 mtorr and deposition temperature from 400 to 450 ° C, on the mechanical properties of SiGe films. Then the effect of excimer Laser annealing (248 nm, 38 ns, 780 mJ /cm²) on stress gradient is analyzed. It is demonstrated that stress gradient can be eliminated completely by depositing SixGe1-x(10% < x < 92%) bilayers, with the bottom film exposed to a single laser pulse, which changes the grain microstructure of both the bottom and top films. Furthermore, laser annealing seems to reduce surface roughness, significantly, which is an attractive feature for some MEMS applications. [ABSTRACT FROM AUTHOR]