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We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of

Side leakage experiments have been performed on the organic interlayer, so-called organic coating for planarization (OCP), in a hybrid thin-film encapsulation (TFE) stack based on two silicon nitride (SiN) barrier layers that was developed for organic light-emitting diodes (OLED). To measure the side leakage into OCP, a metallic Ca thin-film monitor can be used. However, the water uptake capacity of the Ca monitor affects the measurements. Here, we eliminated the contribution of the Ca layer from the measurement by variation of the Ca thickness and by measuring the side leakage until it reaches the Ca layer. For OCP with a water getter inside (5% CaO) the side leakage can be monitored by the loss of scattering of the CaO when it reacts with water to Ca(OH)2. This work describes measurements of the rate of side leakage into the OCP layer of the TFE stack, both for plain OCP and for OCP with CaO getter inside. The side leakage curves are used to derive diffusion coefficients. Performing measurements at various climates provides acceleration factors that are relevant for the performance quantification of the TFE stack. The limiting factors on the performance of an unstructured TFE stack as produced in a roll-to-roll (R2R) process are presented. For small OLED devices side leakage would drastically reduce the shelf lifetime but for larger devices the permeation properties of the TFE stack determine the shelf lifetime.

Organic light-emitting diodes degrade rapidly by means of local cathode oxidation when exposed to the ambient atmosphere, resulting in visible non-emissive areas called black spots. High performance inorganic based encapsulations are required to protect the OLED. We have applied a hybrid thin-film encapsulation stack consisting of two inorganic barrier layers of silicon nitride deposited at low temperature with an organic layer in between. The resulting water permeation mechanism into the OLED is solely by means of lateral pinhole-to-pinhole transport. With the application of CaO nanoparticles in the organic layer the lateral water transport rate is reduced and we show that black spot formation in 8 cm2 OLEDs is delayed by 6000 h at accelerated climate conditions of 60°C/90% relative humidity. This is estimated to correspond to 20 years at ambient conditions.

Local laser ablation of the cathode of OLEDs has been applied to create a population of pinholes of the same size. This enables the direct comparison at different conditions of black spots and grey spots in the emission of OLEDs as a result of water ingress into the device. We confirmed earlier observations on the operational effect of black spot growth as determined in a sequential test on particle induced pinholes. Furthermore, we measured the operational effect in parallel, providing data that are test independent. With the same population of pinholes we studied the operational effect of grey spot growth. The observed larger operational effect of grey spot growth with respect to that of black spot growth is attributed to a lateral flow of protons to the centre of the black spot. In this part of the black spot a depletion region is present which is created by transport of H3O+ to the cathode under the influence of the applied electric field. This proposal is supported by the observation of black and grey spot growth in polymer LEDs on basis of PEDOT:PSS with increased pH.

The requirement for evaluating high performance barrier layers with water vapor transmission rates (WVTR) far below 10−3 g/m2 d has been sparked by the growing application of flexible and organic electronics. While several highly sensitive WVTR-measurement techniques are described in the literature, their accuracy and comparability has not yet been tested. There is an absence of direct comparison of these methods. With a growing body of literature referring to different coating and barrier technologies (often under different testing conditions), it is extremely difficult to gather a coherent picture both of the performance of the materials studied and the permeation measurement methods used. In order to clarify these points we report on independent WVTR measurements of the same batch of a high performance barrier film under two sets of conditions in several laboratories with different state-of the-art methods. These methods also include several calcium test set-ups. The results showed that, while some differences are present, there is a remarkable level of agreement between the measurement methods even prior to harmonization.

The availability of a high performance thin-film barrier is the most critical challenge in upscaling and commercializing flexible OLED products. We report a flexible thin-film-barrier technology that meets lifetime specifications for OLED lighting, and demonstrate it in rollable QVGA a-IGZO AMOLED displays. Roll-to-roll manufacturing of this high performance barrier film will be presented. cop. 2013 Society for Information Display.

To protect organic flexible devices from the ambient, they have to be encapsulated. Depending on the application in mind (OLED lighting, PV) different thin-film encapsulation methodology can be chosen. Each encapsulation process has different requirements and fabrication process freedom might be restricted, for example by mechanical reliability requirements or the total cost of the end product. Here we will show our recent investigations into different thin-film barriers with respect to their application and the route to production.

Textiles are a ubiquitous part of human life. By combining them with electronics to create electronic textile systems, new application fields emerge. In this paper, technology and applications of light-emitting textile systems are presented: a fabric substrate is described for electronic textile with robust interwoven connections between the conductive yarns in it. The fabric robustness, as a function of the electrical reliability of its conductive yarn connections, is shown to hold over large deformations. This fabric is then used to create a light-emitting diode (LED) based photonic textile display. Finally, we will show an example of an application that could make use of such a photonic textile system.

The crack onset strain (COS) of 4-level thin film transistor (TFT) devices on both steel foils and thin polyimide (PI) films was investigated using tensile experiments carried out in situ in an optical microscope. Cracks initiated first within the SiO2 insulator layer for both types of substrates. The COS was found to be equal to 1.15% and 0.24% for steel and PI, respectively. The influence of loading direction on failure of the TFT stack with anisotropic geometry was moreover found to be considerable, leading to recommendations for backplane design. The large difference in critical strain of the SiO2 layer on the two substrates was analyzed using an energy release rate approach, and found to result from differences in layer/substrate mechanical contrast and in internal stress state. Based on this analysis a correlation between layer/substrate elastic contrast and tensile failure behavior was devised. (C) 2010 Elsevier Ltd. All rights reserved.

Resistance measurements during uniaxial tensile deformation of very thin (10 nm) conducting oxide films deposited on 150 nm SiN films on polyethylene naphthalate are discussed. It is first shown that certain characteristics of resistance versus strain curves are representative for the fracture behavior of the SiN film and not for that of the thin conducting oxide film. Subsequently, it is shown that the hysteresis in curves of resistance as a function of strain offers a way to directly measure the intrinsic critical strain of the SiN film without the need to determine internal strains from independent (curvature) measurements that rely on knowledge of moduli and geometry. The method should be applicable, in general, to measure intrinsic critical strain and residual strains of thin brittle films on polymers. Advantages and limitations of the method are discussed.

Nowadays two display types are dominant in the display market: the bulky cathode ray tube (CRT) and liquid crystal displays (LCD). Both types use glass as substrate material. The LCD display is the dominant player for mobile applications, in for instance mobile phones and portable computers. In the development of displays and their applications a clear interest exists to replace the rigid rectangular display cells by free-shaped, curved or even roll-up cells. These types of applications require flexible displays.

Flexible, free shape displays are the enabling technology for new robust, lightweight, extremely thin, portable electronic devices. Polymer Light Emitting Diodes (PLED) are especially suited for these applications, due to their fast response time, low voltage, high luminous efficiency and viewing angle performance. On the other hand, PLED displays are extremely sensitive to moisture and oxygen. Substrate materials provided with high performance hermetic and conducting layers are therefore an essential component for manufacturing these flexible devices. Polymer based substrates provide the necessary mechanical flexibility; they also require several thin, brittle, functional inorganic layers such diffusion barriers and transparent electrodes. The structural integrity, dimensional stability and thermal properties of the substrate stack are crucial to insure device functionality and reliability. For polymer-based substrate several effects lead to dimensional variation of the substrates, such as solvent uptake, physical ageing of the polymer base, thermal expansion and stress induced deformations. These effects must be taken into account to successfully perform classic photolithographic steps.Ink-jet printing is a critical enabling technology for flexible PLED displays, providing a customizable means to dispense solution-based polymers onto a flexible substrate, allowing for multi-color devices. On the other hand, IJP must meet several challenges, especially to comply with industrial applications. For example, accurate landing position of the droplets to form homogeneous hole-transport and electroluminescent layers as well as good wetting characteristic of the substrates must be obtained with reliable high throughput techniques.

Substrate materials for flexible devices are multi-layer composite structures. On top of a base polymer functional inorganic layers such as permeation barriers and conductive layers are applied. Due to the thermal mismatch between polymer and inorganic layer, the layer is compressive loaded at ambient conditions. A characteristic failure mode, occurring with compressive loaded thin layers, is buckling failure. The interface between adjacent layers fails locally, and the thin top layer bends outwards. The buckles have a characteristic width and height. These sizes are used to analyse the compressive strain, present in the layer before failure, and the adhesion quality of the failed interface. A buckle map is introduced to guide this analysis.

A set of propagating cracks in a SiN barrier film on poly ethylene naphthalate (PEN) were subjected to differing levels of relative humidity. It was observed that the propagation speed of the cracks increased for increasing levels of relative humidity. This was shown using two independent, simultaneous techniques. One of the techniques (a resistance measurement) gives a qualitative measure of the averaged crack tip speed and the other (a microscopic technique) a quantitative measure. An attempt is made to quantify the resistance measurements in terms of crack tip speed. The effects that humidity may have on the crack driving force through differences in hygroscopic expansion are discussed, using independent determination of the diffusion constant of water into PEN. It is concluded that hygroscopic expansion alone cannot account for the observations.

Flexible displays present a challenging problem in terms of mechanical integrity, a result of the considerable hygro-thermo-mechanical contrast between the inorganic, brittle device layers and the compliant polymer substrates. This paper reviews the main approaches to study and identify the key factors, which control the mechanical stability of this class of displays. Focus is put on the analyses of residual stress and damage under tensile loading. Novel electro-mechanical methods are used for accurate insight into critical phenomena. An important result is that the thickness and stiffness of the substrate control the critical strain for failure of the device layers.

A flexible version is shown of a state of the art passive matrix LCD; a full colour STN display. By using polymer substrates, “ultra-thin” optical layers (like retarders, colour filters and polarisers) and a flexible backlight a fully flexible CSTN demonstrator is obtained, that can be bend to a radius of 40 mm during operation.

We report on a method to evaluate thin film barriers for direct encapsulation of OLEDs. Based on the corrosion of reactive metal films and modeling thereof, this method is used to quantify the water permeation rate of high-performance diffusion barriers. This method was first used to measure the barrier properties of flexible plastic substrates for display applications [1]. In the present work the system has been automated for improved repeatability and optical calibration has been performed to assess the sensitivity. Effective water vapor transmission rates down to 10−6 g/m2/day can be detected. Permeation data on a multi-layer thin film encapsulant was obtained at three temperatures. To demonstrate compatibility in the application, the same thin film encapsulant was used to package actual passive matrix devices. This is the first report of a quantitative measure of an OLED compatible thin film encapsulant.

Flexible cholesteric texture liquid crystal displays are demonstrated. The 4.2″ diagonal display can be bent over a 20-mm radius of curvature, even during operation. The driving parameters and the cell-gap homogeneity are comparable to those of glass based cells. Images with 16 gray levels are shown on the display.

Measurements are reported of the temperature dependence of the Mossbauer fraction of a number of AuI and AuIII complexes. A simple model is described with which this temperature dependence of the Mossbauer fraction was analysed in terms of intra- and Inter-molecular vibrations. The observed difference between Mossbauer fractions of AuI and AuIII complexes has to be attributed mainly to the larger mass of the latter, rather than to the difference in co-ordination number.

Maintaining electrical conductivity, optical transparency, and mechanical integrity against bending and stretching are key requirements for flexible transparent electrodes. Transparent conducting oxides (TCOs) are widely used thin film electrodes in optoelectronic devices. However, these materials are brittle and reducing film thickness to improve their mechanical integrity compromises their electrical performance. Here we combine TCO thin films with metal grids embedded in a polymer substrate to create hybrid electrodes with low sheet resistance and high resilience to bending. Amorphous zinc tin oxide (ZTO) and aluminum-doped zinc oxide (AZO) films sputtered onto polyethylene-terephthalate (PET) substrates with and without embedded metal grids are studied. The hybrid electrodes have an optical absorptance below 5% in the visible range and their electrical sheet resistance is less than 1 Omega/sq. The critical strain for tensile failure is analyzed through a combination of electrical measurements and in-situ observations of crack initiation and propagation during tensile loading. The mean critical strain for failure of the AZO/metal grid is 8.5% and that of the ZTO/metal grid is as high as 10%. The AZO and ZTO films alone present critical strain values around 0.6% and 1% respectively, demonstrating that the addition of the metal grid considerably improves the resistance onset strain of the electrodes far beyond these critical strain limits. (C) 2016 Elsevier B.V. All rights reserved.

In the present study, 90 nm thick conducting tin-doped indium oxide (ITO) layers on polymer substrates are used to study the failure behaviour of brittle layers. In a two-point bending test the resistance of uniform ITO-layers and narrow ITO-lines (10 to 300 μm width) are determined as a function of the applied tensile strain. At a certain strain, the thin layer will crack and the resistance will strongly increase. This characteristic strain is analysed using a large number of samples. Early stages of crack development are studied in the fragmentation test. This paper presents the results of different failure mechanisms of thin brittle layers on the electrical conductivity of ITO-layers. When the strain in the ITO-layer increases, stable cracks of a limited length are initiated at defects in the layer (crack initiation). At the critical strain εpthe crack is no longer stable and it will propagate over the whole width of the layer (crack propagation). The experiments show a wide failure strain distribution for narrow ITO-lines. The wide distribution of defects, determining the crack initiation strain, controls the failure of narrow lines. The uniform layers show a narrow failure strain distribution. This is determined by the well-defined crack propagation strain εp.