1. 36 Gb/s operation of a BICMOS driver and INP EAM using foundry platforms
- Author
-
Karim Mekhazni, M. Trajkovic, Helene Debregeas, Fabrice Blache, Kevin A. Williams, Marion K. Matters-Kammerer, Xaveer Leijtens, Xi Zhang, Photonic Integration, Integrated Circuits, Center for Care & Cure Technology Eindhoven, Center for Wireless Technology Eindhoven, RF, Center for Quantum Materials and Technology Eindhoven, Institute for Photonic Integration, and Center for Care & Cure Technology Eindhoven (C3Te)
- Subjects
Fabrication ,Materials science ,Extinction ratio ,business.industry ,Photonic integrated circuit ,Keying ,Optical Modulation ,02 engineering and technology ,Integrated circuit ,BiCMOS ,01 natural sciences ,law.invention ,010309 optics ,Driver Circuits ,Photonic Integrated Circuits ,020210 optoelectronics & photonics ,law ,Modulation ,0103 physical sciences ,0202 electrical engineering, electronic engineering, information engineering ,Optoelectronics ,business ,DC bias - Abstract
We demonstrate a clear eye-diagram at 36 Gb/s of a BiCMOS driver directly wire-bonded to an InP electro-absorption modulator (EAM) both fabricated through foundry platforms. The driver is fabricated in a 0.25 μm SiGe:C BiCMOS technology and delivers a maximum of 2 Vp-p amplitude when single-ended. The driver is DC-coupled to the modulator, simplifying the electronic-photonic assembly. The EAM operates in the L-band at 1590 nm, with a DC bias set at –1.6 V for on-off keying non-return to zero modulation. We measure the operation from 10 to 40 Gb/s, recording the dynamic extinction ratio from 5 to 3 dB, respectively. The use of foundry platforms does not require any fabrication process change and offers a wide spectrum of high-performance photonic-electronic integrated circuits.
- Published
- 2020