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3. 2006 was great--Worldwide! But what for 2007?

Author

Mann, Deborah and Pearne, Nick

Subjects
Company growth, Semiconductor industry, Printed circuit board, Market trend/market analysis, Semiconductor industry -- Industry forecasts -- Growth -- Production data -- Forecasts and trends, Printed circuits -- Production data -- Forecasts and trends, Circuit printing -- Production data -- Forecasts and trends
Abstract

2006 Was Great ... As results for 2006 are emerging, it is clear that most of us had a pretty good year. Overall, the world PCB business grew at some […]

Published
2007

4. BPA's HDI forecasts

Author

Hutton, Mark and Pearne, Nick

Subjects
United States. Bonneville Power Administration, Packaging industry -- Economic aspects -- Forecasts and trends, Energy industry -- Forecasts and trends -- Technology application -- Economic aspects, Market trend/market analysis, Technology application, Business, Computers and office automation industries, Electronics and electrical industries
Abstract

At BPA, we see the Credit Crunch as illustrating the need for market modelling and forecasting. BPA's 'Industrial Dynamics' addresses the very factors that triggered the Credit Crunch. We examine [...]

Published
2010

5. China: the sleeping giant

Author

Pearne, Nick

Subjects
Market trend/market analysis, Global economy -- Forecasts and trends -- Economic aspects, Economic conditions -- Forecasts and trends -- Economic aspects, Economic development -- China -- Forecasts and trends, China -- Economic aspects
Abstract

Let China Sleep ... for when she awakes she will shake the world. --Napoleon Bonaparte For centuries, China stood as the leading civilization, outpacing the rest of the world in […]

Published
2008

6. The links between semiconductor forecasts and PCB results

Author

Pearne, Nick

Subjects
Semiconductor industry, Market trend/market analysis, Semiconductor industry -- Forecasts and trends
Abstract

The semiconductor market dynamics provide a good measure and indicator of the components and assembly activities in electronics worldwide. BPA has followed these markets for well more than 20 years […]

Published
2007

7. Do you believe in business cycles?

Author

Mann, Deborah, Pearne, Nick, and Stern, Francesca

Subjects
Company growth, Market trend/market analysis, Electronics industry, Electronics industry -- Forecasts and trends -- Growth
Abstract

When was the last time you saw a consumer stride up to a store counter and demand, 'Show me one with the latest in PCBs. I want the exciting buildup […]

Published
2007

8. BPA's call: China 2006 growth picks up, but slows later this year

Author

Mann, Deborah and Pearne, Nick

Subjects
Microcomputer industry, Computer industry, Computer industry -- Industry forecasts
Abstract

The figures for China shown here must be set against a background of dramatic increases in activity over the last few years. All of the ups and downs of the […]

Published
2006

9. Pyramid scheme: advanced laminate materials

Author

Stern, Francesca and Pearne, Nick

Subjects
Company market share, Composite materials -- Evaluation -- Market share, Laminated materials -- Evaluation -- Market share
Abstract

In BPA Consulting's ongoing work looking at system architecture, component performance and the interconnect needs to bring these together, it has developed a pyramid structure to help companies understand the […]

Published
2005

10. METAL IN THE BOARD: MEETING THE CHALLENGE OF DIGITAL POWER.

Author

PEARNE, NICK and BURR, BILL

Subjects
THERMAL management (Electronic packaging), SEMICONDUCTOR device packaging, ELECTRIC vehicles, PRINTED circuits, MICROVIAS (Electronics)
Abstract

The article discusses the metal in board (MiB) technology to meet the challenges of thermal and power management for new generation of power semiconductor device packaging in electric vehicles. It mentions about several solutions for MiB technology which includes discrete wire printed circuit board, electromobility powertrain and microvias. It also states several building blocks for MiB which include thick copper layers, thermal risers and metal inlays.

Published
2013

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