13 results on '"Patelka, Maciej"'
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2. A technique to measure the thermal resistance at the interface between a micron size particle and its matrix in composite materials.
3. Development of High Thermally Conductive Die Attach for TIM Applications
4. Development of High Thermally Conductive Die Attach for TIM Applications
5. Frequency domain thermoreflectance technique for measuring the thermal conductivity of individual micro-particles
6. Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
7. Development of a Ag/glass die attach adhesive for high power and high use temperature applications
8. Development of Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
9. Retraction of "Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications" [Transactions of The Japan Institute of Electronics Packaging, Vol. 9, pp. E16-007-1–E16-007-6]
10. Development of a Ag/glass die attach adhesive for high power and high use temperature applications
11. Retraction: Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications
12. Development of a Ag/glass die attach adhesive for high power and high use temperature applications.
13. Advanced Materials Development for SiP Applications.
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