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7. III-V/III-N technologies for next generation high-capacity wireless communication

8. Back Barrier Trapping Induced Resistance Dispersion in GaN HEMT: Mechanism, Modeling, and Solutions

9. FinFETs and Their Futures

10. III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance

11. Low-Voltage Scaled 6T FinFET SRAM Cells

12. (Invited) Defect Engineering for Monolithic Integration of III-V Semiconductors on Silicon Substrates

14. Substrate effects in GaN-on-Si HEMT technology for RF FEM applications

16. Environmental Impact of CMOS Logic Technologies

19. Substrate effects in GaN-on-Si HEMT technology for RF FEM applications

20. Evidence of Tunneling Driven Random Telegraph Noise in Cryo-CMOS

21. Comparison of Electrical Performance of Co-Integrated Forksheets and Nanosheets Transistors for the 2nm Technological Node and Beyond

22. ESD HBM Discharge Model in RF GaN-on-Si (MIS)HEMTs

23. Impact of III-N buffer layers on RF losses and harmonic distortion of GaN-on-Si Substrates

25. Transistor modelling for mm-Wave technology pathfinding

26. Solid state qubits: how learning from CMOS fabrication can speed-up progress in Quantum Computing

28. Transistor modelling for mm-Wave technology pathfinding

29. Impact of III-N buffer layers on RF losses and harmonic distortion of GaN-on-Si Substrates

34. Reliability and Variability-Aware DTCO Flow: Demonstration of Projections to N3 FinFET and Nanosheet Technologies

35. GaN on Si: substrate RF modelling

38. Introducing 2D-FETs in Device Scaling Roadmap using DTCO

39. CMOS Cryo-Electronics for Quantum Computing

40. Substrate RF Losses and Non-linearities in GaN-on-Si HEMT Technology

43. From 5G to 6G: will compound semiconductors make the difference?

45. FinFETs and Their Futures

49. 3D Sequential Low Temperature Top Tier Devices using Dopant Activation with Excimer Laser Anneal and Strained Silicon as Performance Boosters

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