615 results on '"Paik, Kyung-Wook"'
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2. A study on the 50 μm fine pitch Flex-on-Flex (FOF) assembly using conventional and nanofiber anisotropic conductive films (ACFs)
3. Investigation on electromagnetic and heat transfer coupling of heating susceptor for selective microwave hybrid soldering: 3D multi-physics simulation and experiment
4. Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques
5. Emerging trends and obstacles in Damascus processing and electroplating for Chiplet industries: A review
6. Unexpected dual cracks in chip-ceramic substrate interconnect: Unveiling the mechanism behind simultaneous cracking at both the top and bottom of a solder joint
7. Effects of neutron irradiation on failure behavior analysis of high-density bumps under thermo-coupling conditions
8. Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances
9. Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method
10. Growth mechanism of intermetallic compound in SnAg/Cu interface of micro-bumps under extremely low-temperature by phase field method
11. A review on heating mechanism, materials and heating parameters of microwave hybrid heated joining technique
12. Grain orientations and failure mechanism of isothermal aged nano Sn-3Ag-0.5Cu/Cu solder joints by microwave hybrid heating and shear mechanical strength
13. The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder
14. Effect of co on the morphology and mechanical properties of the Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joints on ENEPIG surface
15. Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology
16. In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects
17. Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0Ag-0.5Cu/Cu joints
18. A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis
19. Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating
20. Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution
21. The preparation of anisotropic conductive paste and its application in FOB interconnection
22. The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates
23. The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface
24. A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection
25. Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package
26. Challenges and recent prospectives of 3D heterogeneous integration
27. Guest editorial: Heterogeneous integration and chiplets interconnection
28. Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air
29. Investigation on Electromagnetic and Heat Transfer Coupling of Heating Susceptor for Selective Microwave Hybrid Soldering: 3d Multi-Physics Simulation and Experiment
30. ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics
31. The In-Situ TEM Isothermal Aging Evolution in a µ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics
32. Impact of embedded susceptor mass and exposure time on morphological and property alterations in SAC305 joints using microwave hybrid heating
33. Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0Ag-0.5Cu/Cu joints
34. Nano-materials in Anisotropic Conductive Adhesives (ACAs)
35. Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating
36. Metal-Laminated Fabric Substrates and Flexible Textile Interconnection
37. Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic
38. A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives
39. Effect of dimension and defects on the flexibility of ultra-thin chips for wearable electronics
40. Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks
41. Effects of acrylic adhesives property and optimized bonding parameters on Sn[sbnd]58Bi solder joint morphology for flex-on-board assembly
42. Impact of embedded susceptor mass and exposure time on morphological and property alterations in SAC305 joints using microwave hybrid heating
43. A Review: Solder Joint Cracks at Sn-Bi58 Solder ACFs Joints
44. Grain Orientation and Prediction of Thermal Shock Fatigue of Sn-3Ag-0.5Cu Solder Joints for Fan-Out Wafer Level Packaging
45. Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads
46. Systematic modulation of gelation dynamics of snakehead (Channa argus) skin collagen by environmental parameters
47. A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications
48. Editorial: Composite solder joints
49. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly
50. Interface Adhesion Effect of Anchoring Polymer Layer Anisotropic Conductive Films on the Bending Reliability for Ultra-fine Pitch Wearable Chip-on-Flex Packages
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