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3 results on '"PEN foils"'

1. Lithographic patterning of metals on flexible plastic foils

Author

Péter, Mária, Furthner, François, Deen, Jochem, de Laat, Wim J.M., and Meinders, Erwin R.

Subjects
*PLASTIC films, *ELECTRODES, *METALLIC films, *PHOTOLITHOGRAPHY, *PLASMA gases, *SEPARATION (Technology), *ORGANIC solvents
Abstract

Abstract: In this paper the challenges of patterning electrodes with separations in the micron and sub-micron range onto thin polyethylene naphthalate foils for use in biochips are discussed. It was found that it was necessary to improve the adhesion of the metal electrodes to the foil by using plasma treatment and/or an adhesion layer, and a quantitative measurement of this adhesion was preformed using a peel-off tester. Electrode patterning was performed by optical lithography. Two processing methodologies were compared, namely direct patterning of metal films and patterning using a lift-off process. In addition, the effects of organic solvents, sonication, and temperature on film quality were assessed. After optimization of process conditions, biochips with sub-micrometer sized electrode gaps and stable electrode structures were obtained by using the lift-off process. [Copyright &y& Elsevier]

Published
2009
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2. Lithographic patterning of metals on flexible plastic foils

Subjects
Photolithography, Sub microns, Thickness measurement, Patterning electrodes, Sub micrometers, Electrode structures, Optical lithographies, Metal adhesion, Flexible plastics, Metal films, Lift-off process, Direct-patterning, Metal foil, Materials, Electrodes, Adhesion layers, Process conditions, Industrial Innovation, Photolithography on flexible substrates, Plasma treatments, PEN foils, Biochip, Organic solvents, Metal electrodes, Quantitative measurements, Biochips, Film qualities, Metals, Polyethylene naphthalate, Plasma applications, Bioassay, Electrode gaps, Lithographic patterning
Abstract

In this paper the challenges of patterning electrodes with separations in the micron and sub-micron range onto thin polyethylene naphthalate foils for use in biochips are discussed. It was found that it was necessary to improve the adhesion of the metal electrodes to the foil by using plasma treatment and/or an adhesion layer, and a quantitative measurement of this adhesion was preformed using a peel-off tester. Electrode patterning was performed by optical lithography. Two processing methodologies were compared, namely direct patterning of metal films and patterning using a lift-off process. In addition, the effects of organic solvents, sonication, and temperature on film quality were assessed. After optimization of process conditions, biochips with sub-micrometer sized electrode gaps and stable electrode structures were obtained by using the lift-off process. © 2008 Elsevier B.V. All rights reserved.

Published
2009

3. Lithographic patterning of metals on flexible plastic foils

Author

Jochem Deen, Wim J. M. de Laat, Mária Peter, Erwin R. Meinders, François Furthner, and TNO Industrie en Techniek

Subjects
Thickness measurement, Patterning electrodes, Optical lithographies, law.invention, law, Flexible plastics, Metal films, Materials Chemistry, Direct-patterning, Biochip, Materials, Process conditions, Industrial Innovation, Metals and Alloys, Plasma treatments, Surfaces and Interfaces, Adhesion, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Organic solvents, Metal electrodes, Metals, Electrode, Bioassay, Layer (electronics), Lithographic patterning, Photolithography, Sub microns, Materials science, Sub micrometers, Nanotechnology, Electrode structures, Metal adhesion, Lift-off process, Thin film, Metal foil, Polyethylene naphthalate, Lithography, Electrodes, Adhesion layers, Photolithography on flexible substrates, PEN foils, Quantitative measurements, Biochips, Film qualities, Plasma applications, Electrode gaps
Abstract

In this paper the challenges of patterning electrodes with separations in the micron and sub-micron range onto thin polyethylene naphthalate foils for use in biochips are discussed. It was found that it was necessary to improve the adhesion of the metal electrodes to the foil by using plasma treatment and/or an adhesion layer, and a quantitative measurement of this adhesion was preformed using a peel-off tester. Electrode patterning was performed by optical lithography. Two processing methodologies were compared, namely direct patterning of metal films and patterning using a lift-off process. In addition, the effects of organic solvents, sonication, and temperature on film quality were assessed. After optimization of process conditions, biochips with sub-micrometer sized electrode gaps and stable electrode structures were obtained by using the lift-off process. © 2008 Elsevier B.V. All rights reserved.

Published
2009

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