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The scanning electron microscope is a versatile tool and its electron beam techniques have been widely used in semiconductor material and device characterizations. One of these electron beam techniques is the electron-beam-induced current (EBIC) technique. One of the limitations of the conventional EBIC technique is that it requires charge collecting junctions which may not be readily available in junctionless samples such as bare substrates unless some special sample preparation procedure such as the fabrication of a diffused junction is done on the junctionless sample. In this paper, the technique of detecting EBIC current in junctionless samples with the use of a two-point probe is presented. It is found that the EBIC current is independent from its physical parameter when the sample thickness is greater than 4L; the width to the right of probe 2 and the width to the left of probe 1 are greater than 2L and 8L, respectively. The parameters affecting this technique of detecting the EBIC current such as the depth of the generation volume, probe spacing, and the applied bias are also discussed in this paper. A commercially available two-dimensional device simulator was used to verify this technique.

The electron beam technique of the Scanning Electron Microscopy (SEM) has been widely used for the characterization of bipolar devices and photodiode materials. The resolution of an electron beam technique is affected by the interaction of the beam and the specimen. The size of this interaction volume, commonly termed the generation volume, is usually characterized by what is called the electron penetration range and is measured from the surface. Since there is currently no consensus on the expressions to use in the calculation of the electron range, this paper provides an analysis of the three most commonly used semiempirical expressions. They are the Gruen range, the universal curve of Everhart and Hoff, and the maximum range of Kanaya and Okayama. This analysis is done using data from the statistical method of Monte Carlo simulations. It was found that the Everhart and Hoff universal curve performs better at low beam energies than the equation of Kanaya and Okayama. However, the validity of all the three expressions is questionable below 5 keV. In order to overcome this, fitted expressions based on the extrapolated range are provided for beam energies below 5 keV in the case of Si and GaN materials. The accuracy of these expressions is affected by the physical parameters used in the Monte Carlo simulations., ((c) 2007 Wiley Periodicals, Inc.)

Electron beam induced current (EBIC) characterisation can provide detailed information on the influence of crystalline defects on the diffusion and recombination of minority carriers in semiconductors. New developments are required for GaN light emitting devices, which need a cross-sectional approach to provide access to their complex multi-layered structures. A sample preparation approach based on low-voltage Ar ion milling is proposed here and shown to produce a flat cross-section with very limited surface recombination, which enables low-voltage high resolution EBIC characterisation. Dark defects are observed in EBIC images and correlation with cathodoluminescence images identify them as threading dislocations. Emphasis is placed on one-dimensional quantification which is used to show that junction delineation with very good spatial resolution can be achieved, revealing significant roughening of this GaN p-n junction. Furthermore, longer minority carrier diffusion lengths along the c-axis are found at dislocation sites, in both p-GaN and the multi-quantum well (MQW) region. This is attributed to gettering of point defects at threading dislocations in p-GaN and higher escape rate from quantum wells at dislocation sites in the MQW region, respectively. These developments show considerable promise for the use of low-voltage cross-sectional EBIC in the characterisation of point and extended defects in GaN-based devices and it is suggested that this technique will be particularly useful for degradation analysis.