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9 results on '"Ožvold, Milan"'

6. Brazing of Aluminum Tubes Using Induction Heating

Author

Mária Behúlová, Miroslav Sahul, Kristína Demianová, Milan Turňa, and Ožvold Milan

Subjects
Materials science, Induction heating, Metallurgy, General Engineering, chemistry.chemical_element, Induction brazing, law.invention, Induction coil, Vacuum furnace, Optical microscope, chemistry, law, Aluminium, visual_art, Aluminium alloy, visual_art.visual_art_medium, Brazing
Abstract

The contribution deals with the design of a progressive metallurgical joining of the solar collector parts by brazing. The main aim was to replace flame brazing by the more advantageous technology of brazing using high-frequency induction heating. New equipment and the induction coil of a suitable shape were designed for the joint manufacturing. Based on the numerical simulations of electromagnetic and temperature fields, the basic parameters of induction brazing were suggested in order to achieve the desired temperature distribution at the spot of the future joint. To check the quality of the brazed joints, a leak test, optical microscopy and EDX microanalysis were used to study the area of the brazed joints interface. Impact of brazing time and power supply on brazeability of Al alloys components by means of the AlSi12 braze were assessed.

Published
2012

8. THE INFLUENCE OF HEAT TREATMENT ON PROPERTIES OF LEAD-FREE SOLDERS.

Author

Rízeková, Lýdia Tmková, Drienovský, Marián, Pocisková, Katarína, and Ožvold, Milan

Subjects
HEAT treatment of metals, LEAD-free solder, INTERMETALLIC compounds, MICROSTRUCTURE, SUBSTRATES (Materials science)
Abstract

The article is focused on the analysis of degradation of properties of two eutectic lead-free solders SnCu0.7 and SnAg3.5Cu0.7. The microstructures of the intermetallic compound (IMC) layers at the copper substrate - solder interface were examined before and after heat treatment at 150 °C for 50, 200, 500 and 1000 hours. The thickness of IMC layers of the Cu6Sn5 phase was growing with the increasing time of annealing and shown the typical scallops. For the heat treatment times of 200 hours and longer, the Cu3Sn IMC layers located near the Cu substrate were also observed. The experiments showed there is a link between the thickness of IMC layers and decrease of the shear strength of solder joints. In general, the joints made of the ternary solder showed higher shear strength before and after heat treatment in comparison to joints from solder SnCu0.7. [ABSTRACT FROM AUTHOR]

Published
2015

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