81 results on '"Nogami, Takeshi"'
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2. Interconnect Processing: Integration, Dielectrics, Metals
3. Wet Chemical Processes for BEOL Technology
4. Interconnect Processing: Integration, Dielectrics, Metals
5. Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams.
6. Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
7. (Invited) Innovations to Enable Extension of Cu Interconnects and Shift to Alternative Conductor
8. (Invited) Scaling of Copper Interconnection As Opposed to Alternative Conductors
9. Advanced BEOL Interconnects
10. Novel low k Dielectric materials for nano device interconnect technology
11. Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
12. PEALD Ru Liner Conformality and Cu Trench Fill Characteristics
13. Microstructure and reliability of copper interconnects
14. Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
15. Overview of interconnect technology for 7nm node and beyond - New materials and technologies to extend Cu and to enable alternative conductors (invited)
16. Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications
17. Pancreatic neuroendocrine carcinoma with exocrine differentiation in a young cat
18. Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
19. Extendibility of CuMn Alloy-Seed Interconnects and the Fundamentals
20. Erratum: Self-Assembled Nano-Stuffing Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects [ECS J. Solid State Sci. Technol.,2, P471 (2013)]
21. Erratum: CVD and ALD Co(W) Films Using Amidinato Precursors as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects [ECS J. Solid State Sci. Technol.,2, P311 (2013)]
22. CVD and ALD Co(W) Films Using Amidinato Precursors as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects
23. Self-Assembled Nano-Stuffing Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects
24. Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects
25. 638 Analysis of Particle Damping with Hollow Steel Particles
26. Analysis of Particle Damping with Hollow Steel Particles
27. 207305 Damping Effect of Particle Damper Using Metallic Hollow Spheres
28. In-situ observation of electromigration failure in AlCuSi interconnects with a passivation film
29. Self-Assembly Based Air-Gap Integration
30. Reply to comment on ‘Yamada H, Nakamura F, Watanabe Y, Murakami M and Nogami T. 2005. Measuring hydraulic permeability in a streambed using the packer test.Hydrological Processes19: 2507-2524’
31. 3235 A Method for Estimating the Lubrication Performance of Metalworking Fluids
32. Interaction between Additives in Metalworking Fluids under Difficult Cutting Conditions
33. Structural Analysis of the Fundamental Polymer of the Sheath Constructed bySphaerotilus natans
34. ANALYSIS OF STREAM CHANNEL GEOMETRY AND PHYSIOGRAPHIC FORMATIVE PROCESS IN VALLEY FLATS
35. Low-k/Cu Integration Consistent from 90nm thru 32nm (invited)
36. Physical and Chemical Roles of Metalworking Fluids in a Vibration-Assisted Tapping System
37. Micrococcus Blood Stream Infection in Patients Receiving Epoprostenol
38. Measuring hydraulic permeability in a streambed using the packer test
39. QUANTITATIVE CLASSIFICATION OF TOPOGRAPHICAL FEATURES OF STEEP-STREAM RIVERBEDS
40. RESEARCH ON CLASSIFICATION OF HABITAT IN MOUNTAIN RIVERS
41. Research on Fish Habitats in the Makomanai River
42. IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects
43. Cu behaviors induced by aging and their effects on electromigration resistance on Al-Cu lines
44. Electromigration Lifetime as a Function of Line Length or Step Number
45. IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects.
46. Structural Analysis of the Fundamental Polymer of the Sheath Constructed by Sphaerotilus natans.
47. Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers
48. PEALD Ru Liner Conformality and Cu Trench Fill Characteristics
49. The Impact of Linewidth and Line Density on the Texture of Electroplated Cu in Damascene-Fabricated Lines
50. Erratum: Self-Assembled Nano-Stuf?ng Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects [ECS J. Solid State Sci. Technol., 2, P471 (2013)]
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