152 results on '"Ning, Puqi"'
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2. A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module
3. CoP Quantum Dots Embedded in Carbon Polyhedra through Co─P─C Bonding Enabling High‐Energy Lithium‐Ion Capacitors
4. Online monitoring of IGBT junction temperature based on Vce measurement
5. Review of Hybrid Packaging Methods for Power Modules
6. Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module Under Power Cycling
7. On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules under Power Cycling Conditions
8. Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module under Power Cycling
9. Online Junction Temperature Measurement of Double-sided Cooling IGBT Power Module through On-state Voltage with High Current
10. Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging
11. Monitoring of SiC MOSFET junction temperature with on-state voltage at high currents
12. A Novel Method for Busbar Design of Electric Vehicle Motor Drive
13. A novel high-temperature planar package for SiC multichip phase-leg power module
14. Accurate evaluation of cooling system capability of three-phase IGBT-based inverter
15. Online monitoring of IGBT junction temperature based on Vce measurement
16. Monitoring of SiC MOSFET junction temperature with on-state voltage at high currents
17. Review of power module automatic layout optimization methods in electric vehicle applications
18. An Electrothermal Model for IGBT Based on Finite Differential Method
19. Analyzing ZVS Soft Switching Using Single Phase Shift Control Strategy of Dual Active Bridge Isolated DC-DC Converters
20. Review of Si IGBT and SiC MOSFET based on hybrid switch
21. The Engineering Design of SiC Hybrid Switch Series
22. Online Monitoring of IGBT junction Temperature Based on Vce Measuremnt
23. A Prospect of Hybrid Planar Power Module
24. Investigation on thermal stress of bondline based on Cu@Sn preform at high temperature application
25. The Development of a 1200V/400A SiC Hybrid Module
26. A Genetic Algorithm Based Motor Controller System Automatic Layout Method
27. The development of 1200 V SiC Hybrid Switched power modules
28. A 30kW Three-Phase Voltage Source Inverter Based on The Si IGBT/SiC MOSFET Hybrid Switch
29. A genetic algorithm high power density converter system packing method
30. Study on Moisture Absorption Characteristics of Power Plastic Packaging Devices
31. Comparison and Analysis of Power Cycling and Thermal Cycling Lifetime of IGBT Module
32. Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment
33. Gate Drive Design for a Hybrid Si IGBT/SiC MOSFET Module
34. Top die surface reprocessing for planar package with double sided cooling
35. Temperature dependency of the on-state voltage of IGBT and its application in thermal resistance test
36. New Materials and Related New Equipment Targeting Integration of Smart Grid and Energy Grid
37. A hybrid Si IGBT and SiC MOSFET module development
38. An improved planar module automatic layout method for large number of dies
39. Engineering investigation on compact power module for EV application
40. Reliability modeling and analysis of SiC MOSFET power modules
41. Interpretation method investigation of converter system layout design
42. Analysis and prediction of electromagnetic interference in power electronic converter
43. Automatic layout design for gate driver of SiC MOSFET
44. A study on the effect of DC-link decoupling capacitors
45. An automatic EMI filter design methodology for electric vehicle application
46. Technical approaches towards ultra-high power density SiC inverter in electric vehicle applications
47. Low temperature liquid bonding using Cu@Sn preform for high temperature die attach
48. Transient thermal FE-model calibration based on thermal structure functions for power modules
49. A hybrid genetic algorithm for automatic layout design of power module
50. An exploration of thermo-sensitive electrical parameters to estimate the junction temperature of silicon carbide mosfet
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