37 results on '"Ng, Fei Chong"'
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2. Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process
3. Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
4. Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
5. Smooth particle hydrodynamics modelling of liquid-sediment system and coastal wave breaker
6. Surface energetic-based analytical filling time model for flip-chip underfill process
7. Effect of different temperature distribution on multi-stack BGA package
8. Effect of Dispensing Type On Void Formation Using Convolutional Neural Network
9. Spatial analysis of underfill flow in flip-chip encapsulation
10. Particle Image Velocimetry Dynamic Analysis on the Penstock Vortex Flow for the Dam Reliability Study
11. Filling efficiency of flip-chip underfill encapsulation process
12. Effect of Barrier Height on the Design of Stepped Spillway Using Smoothed Particle Hydrodynamics and Particle Image Velocimetry
13. A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process
14. Deep learning and analytical study of void regional formation in flip-chip underfilling process.
15. Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches
16. Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
17. CUF scaling effect on contact angle and threshold pressure
18. Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
19. Numerical modelling of penstock flow in dam
20. Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process.
21. Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process
22. Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA
23. Symmetrical Unit-Cell Numerical Approach for Flip-Chip Underfill Flow Simulation
24. Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process
25. Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
26. Underfill Flow in Flip-Chip Encapsulation Process: A Review
27. Performance Evaluation of Composite Cross-Arm Structure Under Different Magnitude of Loading
28. Spatial analysis of underfill flow in flip-chip encapsulation
29. Failure analysis of various fiberglass cross-arm designs under multi-axial loading
30. Effect of Contact Angle on Meniscus Evolution and Contact Line Jump of Underfill Fluid Flow in Flip-Chip Encapsulation
31. Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation
32. Filling efficiency of flip-chip underfill encapsulation process
33. Visualization of Underfill Flow in Ball Grid Array (BGA) using Particle Image Velocimetry (PIV)
34. Effect of the gap height of radial gate on the volumetric flow rate in dam
35. Fluid/structure interaction study on the variation of radial gate’s gap height in dam
36. Scaling Effect on Velocity Profiles in Capillary Underfill Flow
37. Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process
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