83 results on '"Nai, S. M. L."'
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2. Development of WC-Inconel composites using selective laser melting
3. The role of powder layer thickness on the quality of SLM printed parts
4. Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder
5. Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints
6. Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
7. Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
8. Using Microwave-Assisted Powder Metallurgy Route and Nano-size Reinforcements to Develop High-Strength Solder Composites
9. Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates
10. Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders
11. Lead-free solder reinforced with multiwalled carbon nanotubes
12. Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging
13. Selective laser melting enabling the hierarchically heterogeneous microstructure and excellent mechanical properties in an interstitial solute strengthened high entropy alloy
14. Interplay between microstructure and deformation behavior of a laser-welded CoCrFeNi high entropy alloy
15. Enhanced Mechanical Properties of Poly(Vinyl Alcohol) Nanofibers With Molecular Level Dispersed Graphene
16. Influence of Bonding Pressure on the Mechanical Properties of Copper Bumps
17. Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
18. Effect of Ni-Coated Carbon Nanotubes on the Creep Behavior of Sn-Ag-Cu Solder by Nanoindentation
19. NANOMECHANICAL PROPERTIES OF A Sn–Ag–Cu SOLDER REINFORCED WITH Ni-COATED CARBON NANOTUBES
20. Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
21. INDENTATION SIZE EFFECT ON THE CREEP BEHAVIOR OF A SnAgCu SOLDER
22. Thermal Management for High Power Light-Emitting Diode Street Lamp
23. Enhancement of Mechanical Properties by Reinforcing Magnesium With Ni-Coated Carbon Nanotubes
24. Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder
25. Integrating copper at the nanometer length scale with Sn–3·5Ag solder to develop high performance nanocomposites
26. Enhancing the properties of a lead-free solder with the addition of Ni-coated carbon nanotubes
27. Advanced high density interconnect materials and techniques
28. DFT Study on Nano Structures of Sn/CNT Complex for Potential Li-Ion Battery Application
29. Using Microwave-Assisted Powder Metallurgy Route and Nano-size Reinforcements to Develop High-Strength Solder Composites
30. A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints
31. Indentation Size Effect on the Hardness of a Sn-Ag-Cu Solder
32. Utilizing energy efficient microwave sintering to significantly enhance the tensile response of a lead-free solder
33. Development of Al and Al/Cu (composite/alloy) formulations with enhanced properties through microwave power variations during hybrid sintering
34. Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders
35. Using carbon nanotubes to enhance creep performance of lead free solder
36. Effect of Nano-Size Oxide Based Reinforcement on the Tensile Properties of Sn-Ag-Cu Solder
37. Development of Lead-Free Nanocomposite Solders Using Oxide Based Reinforcement
38. Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
39. Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder
40. Effect of Presence of Multi-Walled Carbon Nanotubes on the Creep Properties of Sn-Ag-Cu Solder
41. DEVELOPMENT OF NOVEL LEAD-FREE SOLDER COMPOSITES USING CARBON NANOTUBE REINFORCEMENTS
42. Development of Advanced Lead-Free Solder Based Interconnect Materials Containing Nanosized Y2O3 Particulates
43. Effect of Presence of Carbon Nanotubes on the Wettability and Mechanical Performance of Sn-Ag-Cu Solder
44. Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer
45. Synthesis and wear of Al based, free standing functionally gradient materials: effects of different reinforcements
46. Enhancing the Performance of Sn-Ag-Cu Solder With the Addition of Titanium Diboride Particulates
47. Synthesis of Al/SiC based functionally gradient materials using technique of gradient slurry disintegration and deposition: effect of stirring speed
48. Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder.
49. Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder.
50. Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
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