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beta-Ga2O3 is a wide bandgap semiconductor with electrical properties better than SiC and GaN which makes it promising for applications of next-generation power devices. However, the thermal conductivity of \b{eta}-Ga2O3 is more than one order of magnitude lower than that of SiC and GaN, resulting in serious thermal management problems that limit device performance and reliability. This work reports selectively transferring of high thermal conductivity 3C-SiC thin film grown on Si to beta-Ga2O3 (001) substrate using surface activated bonding (SAB) technique at room temperature, to attempt extracting the heat from the surface of the devices. A 4.5-nm-thick interfacial crystal defect layer is formed at the as-bonded 3C-SiC/beta-Ga2O3 interface. The thickness of the interfacial crystal defect layer decreases with increasing annealing temperature, which decreases to 1.5 nm after annealing at 1000 C. No voids and unbonded area are observed at the interfaces, even after annealing at temperature as high as 1000 C. The thermal boundary conductance (TBC) of the 1000 C-annealed 3C-SiC/beta-Ga2O3 interface and thermal conductivity of the beta-Ga2O3 substrate was measured by time-domain thermoreflectance (TDTR). The 3C-SiC/beta-Ga2O3 TBC value was determined to be 244 MW/m2-K, which is the highest value ever reported for SiC/Ga2O3 interfaces, due to the high-quality heterointerface. Our works demonstrate that selective transferring of 3C-SiC film to the beta-Ga2O3 substrate is an efficient path to improve heat dissipation of the \b{eta}-Ga2O3 power devices.

High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as either active functional materials or thermal management materials. We report an isotropic high thermal conductivity over 500 W m-1K-1 at room temperature in high-quality wafer-scale cubic silicon carbide (3C-SiC) crystals, which is the second highest among large crystals (only surpassed by diamond). Furthermore, the corresponding 3C-SiC thin films are found to have record-high in-plane and cross-plane thermal conductivity, even higher than diamond thin films with equivalent thicknesses. Our results resolve a long-lasting puzzle that the literature values of thermal conductivity for 3C-SiC are perplexingly lower than the structurally more complex 6H-SiC. Further analysis reveals that the observed high thermal conductivity in this work arises from the high purity and high crystal quality of 3C-SiC crystals which excludes the exceptionally strong defect-phonon scatterings in 3C-SiC. Moreover, by integrating 3C-SiC with other semiconductors by epitaxial growth, we show that the measured 3C-SiC-Si TBC is among the highest for semiconductor interfaces. These findings not only provide insights for fundamental phonon transport mechanisms, also suggest that 3C-SiC may constitute an excellent wide-bandgap semiconductor for applications of power electronics as either active components or substrates.

In spintronics, one of the long standing questions is why the MgO-based magnetic tunnel junction (MTJ) is almost the only option to achieve a large tunnelling magnetoresistance (TMR) ratio at room temperature (RT) but not as large as the theoretical prediction. This study focuses on the development of an almost strain-free MTJ using metastable bcc CoxMn100-x ferromagnetic films. We have investigated the degree of crystallisation in MTJ consisting of CoxMn100-x/MgO/CoxMn100-x (x = 66, 75, 83 and 86) in relation to their TMR ratios. Cross-sectional high resolution transmission electron microscopy (HRTEM) reveals that almost consistent lattice constants of these layers for 66 < x < 83 with maintaining large TMR ratios of 229% at RT, confirming the soft nature of the CoxMn100-x layer with some dislocations at the MgO/Co75Mn25 interfaces. For x = 86, on the other hand, the TMR ratio is found to be reduced to 142% at RT, which is partially attributed to the increased number of the dislocations at the MgO/Co86Mn14 interfaces and amorphous grains identified in the MgO barrier. Ab-initio calculations confirm the crystalline deformation stability across a broad compositional range in CoMn, proving the advantage of a strain-free interface for much larger TMR ratios.

The demand for single photon sources at $\lambda~=~1.54~\mu$m, which follows from the consistent development of quantum networks based on commercial optical fibers, makes Er:O$_x$ centers in Si still a viable resource thanks to the optical transition of $Er^{3+}~:~^4I_{13/2}~\rightarrow~^4I_{15/2}$. Yet, to date, the implementation of such system remains hindered by its extremely low emission rate. In this Letter, we explore the room-temperature photoluminescence (PL) at the telecomm wavelength of very low implantation doses of $Er:O_x$ in $Si$. The emitted photons, excited by a $\lambda~=~792~nm$ laser in both large areas and confined dots of diameter down to $5~\mu$m, are collected by an inverted confocal microscope. The lower-bound number of detectable emission centers within our diffraction-limited illumination spot is estimated to be down to about 10$^4$, corresponding to an emission rate per individual ion of about $4~\times~10^{3}$ photons/s., Comment: 13 pages, 4 figures