1. Development of a Customized Blockchain Technology-Based Parameter Matching Protocol for Semiconductor Manufacturing
- Author
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Myoung Soo Choi, Jumyung Um, and Sang-Seok Lee
- Subjects
Blockchain ,operational parameter ,parameter matching ,protocol ,semiconductor equipment ,Electrical engineering. Electronics. Nuclear engineering ,TK1-9971 - Abstract
This paper introduces a novel solution to mitigate the vulnerability of operational parameter tampering in the semiconductor industry through a customized blockchain protocol. Faced with high costs and rapid market demands, the industry often struggles with production efficiency due to the variability in equipment operators’ skills and human errors. This challenge is compounded by the necessity for continuous parameter updates and collaboration with equipment suppliers. Our proposed solution leverages the security strengths of blockchain technology, renowned for its secure, immutable record-keeping capabilities. We focus on developing a specialized blockchain-based system, the blockchain-based parameter matching (BBPM) protocol, to manage and safeguard operational parameters within semiconductor manufacturing. This system is designed to ensure secure, tamper-proof information updates, addressing the industry’s need for reliable and efficient parameter management. The BBPM protocol addresses the dual risks of unauthorized parameter modifications and unintended changes by authorized users, ensuring the integrity of operational parameters crucial for quality control in semiconductor processes. This protocol represents a transformative shift in operational parameter management systems from traditional centralized models to a distributed approach. By adopting a decentralized and tamper-resistant framework, the BBPM protocol can enhance the efficiency and quality of operational parameter management while reducing the need for extensive data storage, a common challenge in centralized systems. This shift marks a critical advancement in information management and security within the semiconductor manufacturing.
- Published
- 2024
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