19 results on '"Mujeebu, M.A."'
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2. Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process
3. 3-D conjugate heat transfer analysis of PLCC packages mounted in-line on a Printed Circuit Board
4. Numerical and experimental investigations on effect of fan height on the performance of piezoelectric fan in microelectronic cooling
5. Development and performance analysis of novel cast copper–SiC–Gr hybrid composites
6. A CFD-based experimental analysis on the effect of free stream cooling on the performance of micro processor heat sinks
7. Three-dimensional modeling of mold filling in microchip encapsulation process with a matrix-array arrangement
8. Heat Transfer Enhancement Using Piezoelectric Fan in Electronic Cooling - Experimental and Numerical Observations
9. Numerical investigation of heat transfer in Plastic Leaded Chip Carrier (PLCC) packages in in-line arrangement
10. Experimental Investigation and Optimization of Heat Input and Coolant Velocity of Finned Twin U-Shaped Heat Pipe for CPU Cooling
11. Development of Flexible Wings and Flapping Mechanism with Integrated Electronic Control System, for Micro Air Vehicle Research
12. Feasibility study of cogeneration in a plywood industry with power export to grid
13. Fabrication and study on tribological characteristics of cast copper–TiO2–boric acid hybrid composites
14. A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)
15. Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP)
16. Effect of piezoelectric fan height on flow and heat transfer for electronics cooling applications.
17. Experimental Investigation and Optimization of Heat Input and Coolant Velocity of Finned Twin U-Shaped Heat Pipe for CPU Cooling.
18. Development of Flexible Wings and Flapping Mechanism with Integrated Electronic Control System, for Micro Air Vehicle Research.
19. Fabrication and study on tribological characteristics of cast copper–TiO2–boric acid hybrid composites
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