Search

Your search keyword '"Moyal, Efrat"' showing total 9 results
Start Over Author "Moyal, Efrat"
9 results on '"Moyal, Efrat"'

2. A controlled, mechanical method for MEMS decapsulation

Author

Tan, Hao, primary, Moyal, Efrat, additional, Yap, Huei Hao, additional, Zhao, Yu Zhe, additional, He, Ran, additional, Ma, Yin Zhe, additional, Liu, Bing Hai, additional, Chen, Chang Qing, additional, Tan, Pik Kee, additional, Lam, Jeffrey, additional, and Mai, Zhi Hong, additional

Published
2017
Full Text
View/download PDF

4. ISTFA 2018 HIGHLIGHTS All Things Failure Analysis, in Four Impactful Days.

Author

Moyal, Efrat

Subjects
*FAILURE analysis, *QUALITY control, *ROOT cause analysis, *STRUCTURAL failures, *SYSTEM failures, *TRADE shows, *SALES promotion
Abstract

The article focuses on the Electronic Device Failure Analysis Society's 2018 International Symposium for Testing and Failure Analysis in the U.S. The event gathered failure analysts from around the world for a unique chance to learn from peers, resolve FA challenges together, and build lasting networking connections through tutorials, workshops, and panel discussion, as well as an expo floor featuring 118 exhibits with experts providing live demonstrations.

Published
2019
Full Text
View/download PDF

8. Cleaving Breakthrough: A New Method Removes Old Limitations.

Author

Moyal, Efrat and Brandstädt, Ekkehart

Subjects
*SEMICONDUCTOR industry, *SEMICONDUCTOR wafer manufacturing, *SEMICONDUCTOR wafer bonding, *MICROELECTRONICS
Abstract

The article presents case studies related to the indent-and cleaving method developed by LatticeGear LLC, cleaving solutions provider for semiconductor industry. Topics discussed include effectiveness of the method as compare to manual cleaving, factors related to the scribe-and-cleaving method and sample-preparation success through the indent-and-cleaving technique. Several tables are also presented related to the comparison of the methods.

Published
2014
Full Text
View/download PDF

9. ISTFA/2018 PREVIEW.

Author

Moyal, Efrat

Subjects
*FAILURE analysis, *CONFERENCES & conventions
Abstract

The article offers information on the 44th International Symposium for Testing and Failure Analysis (ISTFA) in Phoenix, Arizona on October 28 to November 1, 2018.

Published
2018

Catalog

Books, media, physical & digital resources
See catalog results