871 results on '"Motoyoshi M"'
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2. Safe placement techniques for self-drilling orthodontic mini-implants
3. Development of SOI pixel process technology
4. Habitual intake of carbonated drinks is associated with subjective difficulty in swallowing in community-dwelling older adults: a survey-based cross-sectional study
5. Mechanical anisotropy of orthodontic mini-implants
6. Bone stress for a mini-implant close to the roots of adjacent teeth - 3D finite element analysis
7. The effect of cortical bone thickness on the stability of orthodontic mini-implants and on the stress distribution in surrounding bone
8. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications
9. Cortical bone thickness in the buccal posterior region for orthodontic mini-implants
10. A genotyping array for the globally invasive vector mosquito, Aedes albopictus
11. Application of orthodontic mini-implants in adolescents
12. System Implementation of Synchronized SS-CDMA for QZSS Safely Confirmation System
13. Effects of Visual–Motor Illusion via Image Videos Showing Increased Exercise Intensity on the Tibial Anterior during Sit-to-Stand Movement: A Study of Healthy Participants
14. The importance of taste on swallowing function
15. Advanced Tape Expansion/Assembly Technology for FOWLP and Micro-LED Display
16. Reliability of 60-nm scale CAAC-IGZO FET
17. Demodulation characteristics of a 20GHz-band direct RF undersampling receiver
18. An image rejection type Ku-band direct RF undersampling CMOS receiver
19. Back-via 3D integration technologies by temporary bonding with thermoplastic adhesives and visible-laser debonding
20. A CMOS series/shunt switching type S/H IC for Ka-band direct RF under sampling receiver
21. 3D integration technology for sensor application using less than 5μm-pitch gold cone-bump connpdfection
22. Relationship between oral function and life‐space mobility or social networks in community‐dwelling older people: A cross‐sectional study
23. Via-last/backside-via 3D integration using a visible-light laser debonding technique
24. Design of well-behaved low-loss millimetre-wave CMOS transmission lines
25. Process parameter calibration for millimeter-wave CMOS back-end device design with electromagnetic field analysis
26. A preliminary study of the effects of low-intensity pulsed ultrasound exposure on the stability of orthodontic miniscrews in growing rats
27. On the length of THRU standard for TRL de-embedding on Si substrate above 110 GHz
28. 14.4mW 10Gbps CMOS limiting amplifier with local DC offset cancellers
29. On the choice of cascade de-embedding methods for on-wafer S-parameter measurement
30. 150GHz Divide-by-Three CMOS Frequency Divider with Power Line Injection
31. THz Matrix-Based Layered Wrapper Model of Common-Source MOSFET
32. Analysis of a force system for upper molar distalization using a trans-palatal arch and mini-implant: a finite element analysis study
33. Stacked SOI pixel detector using versatile fine pitch μ-bump technology
34. Design of Power-Efficient 130GHz Common-Source Amplifiers
35. Efficient palatal expansion with a quadhelix appliance: an in vitro study using an experimental dental arch model
36. Orthodontic mini-implant stability and the ratio of pilot hole implant diameter
37. Friction heat during self-drilling of an orthodontic miniscrew
38. Relationship between masseter muscle size and maxillary morphology
39. A 120-GHz transmitter and receiver chipset with 9-Gbps data rate using 65-nm CMOS technology
40. 4.8 GHz CMOS Frequency Multiplier Using Subharmonic Pulse-Injection Locking for Spurious Suppression
41. High-speed estimation of MIMO system capacity using a hierarchical approach and preprocessing digital maps
42. Effects of root morphology on stress distribution at the root apex
43. 58.8∕39.2 GHz dual-modulus CMOS frequency divider with 9.2×5.2 [micro sign]m core size
44. Tapered orthodontic miniscrews induce bone-screw cohesion following immediate loading
45. Inclination of the occlusal plane is associated with the direction of the masticatory movement path
46. A study for 0.18 /spl mu/m high-density MRAM
47. A 2.6-mW 106-GHz transmission-line-based voltage-controlled oscillator integrated in a 65-nm CMOS process.
48. A 120 GHz / 140 GHz dual-channel ASK receiver using standard 65 nm CMOS technology.
49. 116GHz CMOS injection locked oscillator with −99.3dBc/Hz at 1MHz offset phase noise.
50. D-band 3.6-dB-insertion-loss ASK modulator with 19.5-dB isolation in 65-nm CMOS technology.
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