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22 results on '"Motalab, Mohammad Abdul"'

1. Study of Uniaxial Tensile Properties of Hexagonal Boron Nitride Nanoribbons

Author

Paul, Ratul, Tasnim, Tamanna, Dhar, Rajkumar, Mojumder, Satyajit, Saha, Sourav, and Motalab, Mohammad Abdul

Subjects
Condensed Matter - Materials Science
Abstract

Uniaxial tensile properties of hexagonal boron nitride nanoribbons and dependence of these properties on temperature, strain rate, and the inclusion of vacancy defects have been explored with molecular dynamics simulations using Tersoff potential. The ultimate tensile strength of pristine hexagonal boron nitride nanoribbon of 26 nm x 5 nm with armchair chirality is found to be 100.5 GPa. The ultimate tensile strength and strain have been found decreasing with increasing the temperature while an opposite trend has been observed for increasing the strain rate. Furthermore, the vacancy defects reduce ultimate tensile strength and strain where the effect of bi-vacancy is clearly dominating over point vacancy.

Published
2017

2. Analysis of the triga mark-II benchmark ieu-comp-therm-003 with monte carlo code openmc.

Author

Islam, Saad and Motalab, Mohammad Abdul

Subjects
*CRITICALITY (Nuclear engineering), *NUCLEAR reactor cores, *COMPUTER programming, *PROJECT evaluation, *LIBRARIES
Abstract

Ensuring the reliable use of particle transport computer codes necessitates verification against benchmark experiments. This study aims to verify the Monte Carlo code OpenMC using the criticality benchmark model IEUCOMP-THERM-003 from the International Criticality Safety Benchmark Evaluation Project (ICSBEP) Handbook. The analysis focuses on the TRIGA Mark II reactor cores 132 and 133, employing nuclear cross-section libraries ENDF/B-VIII.0, ENDF/B-VII.1, ENDF/B-VII.0, and ENDF/BVI. 2. Results show that OpenMC provides KEFF values in close agreement with benchmark values, demonstrating its robustness in neutronic simulations. Comparison with MVP code results obtained previously, particularly with JENDL-3.3, shows similar accuracy. [ABSTRACT FROM AUTHOR]

Published
2024
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10. EFFECT OF MECHANICAL CRIMP OF JUTE FIBRE ON THE THERMAL PROPERTIES OF WOVEN FABRICS.

Author

Akter, Shilpi, Motalab, Mohammad Abdul, and Helali, Maksud

Subjects
JUTE fiber, THERMAL conductivity, THERMAL properties, TEXTILES, FIBERS, BIODEGRADABLE materials, POROSITY
Abstract

The aim of this paper is to find the effect of mechanical crimp of jute fibre on the thermal properties of woven jute fabrics. In this study, crimp box and gear crimping method were used to impart mechanical crimp into jute sliver. Crimps were divulged to enhance the cohesion between fibres that make it suitable for spinning. Jute yams were produced by inserting a different number of crimps and woven fabrics were produced by using these yams. Fabric thickness, porosity, air permeability and thermal conductivity tests were done according to standard method and found that fabric porosity, air permeability and thermal conductivity of the fabric decreased and fabric thickness increased with the increased number of crimps and fabrics from gear crimping method showed better effect than that of crimp box method. The study on jute woven fabric will provide quantitative experimental data for potential applications with advantages of lightweight, cost-effective, easy to manufacture, biodegradable and excellent mechanical properties. [ABSTRACT FROM AUTHOR]

Published
2022
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11. Effect of thermal aging on electromigration failure of a flip-chip SnAgCu solder joint subjected to random vibration.

Author

Motalab, Mohammad Abdul, Ahmed, Md. Tusher, Bappy, Md. Omarsany, Alam, Muhammad Mahbubul, Rahman, Muhammad Ashiqur, and Ali, Mohammad

Subjects
*FLIP chip technology, *SOLDER joints, *SOLDER & soldering, *RANDOM vibration, *ELECTRODIFFUSION, *DETERIORATION of materials, *FINITE element method
Abstract

Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issues found in electronic packages. This current investigation deals with the effects of mechanical property degradations of SAC (SnAgCu) solder materials of different Ag percentages due to thermal aging on electromigration oriented failure of small scale flip chip solder bumps. Thermal aging causes degradation of strength as well as elastic modulus of the SAC solder material. This degradation in stress-strain behavior plays an utterly important role in electromigration oriented mass diffusion and subsequent failure in the solder joints. This research highlights the linkage between thermal aging oriented strength degradation and its effect on electromigration oriented void propagation rate and time to failure. Structural-electric-diffusion analyses with commercial finite element analysis software have been performed for different aging conditions (1 to 20 days of aging at 100 °C) at different electromigration temperatures. Percentage of Ag generally varies between 1-4% in solder joints of commercially available packages. Presence of Ag in a higher amount causes formation of Ag3Sn in a large amount which increases mechanical strength of SAC materials. So the effect of Ag percentage on SAC solder materials has also been analyzed in the current study. Finally, the effect of random vibration observed in many real world applications on electromigration oriented failure of flip-chip solder joint has also been investigated. Findings from the analysis indicate that mass diffusion due to electromigration and associated stress migration actually reduces with the increment of aging time and thus increases time to failure in case of a flip chip solder joint. Moreover, increment in Ag percentage increases diffusion flux as well as plastic work per volume (PLWK) or otherwise known as plastic strain energy in SAC material. Finally, analysis revealed that inclusion of random vibration expedites electromigration failure significantly. [ABSTRACT FROM AUTHOR]

Published
2020
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