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246 results on '"Moehrle M"'

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31. Flip-Chip Integration of InP and SiN

33. Actively Aligned Flip-Chip Integration of InP to SiN Utilizing Optical Backscatter Reflectometry

38. Improved threshold of buried heterostructure InAs/GaInAsP quantum dot lasers.

39. Recent Developments in Polymer-Based Photonic Components for Disruptive Capacity Upgrade in Data Centers

40. 112 Gb/s PDM-PAM4 Generation and 80 km Transmission Using a Novel Monolithically Integrated Dual-Polarization Electro-Absorption Modulator InP PIC

41. Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators

42. Prospective multicentre cohort study on 9154 surgical procedures to assess the risk of postoperative bleeding - a DESSI study

44. Enabling low-cost high-volume production compatible terabit transceivers with up to 1.6 Tbps capacity and 100Gbps per lane PAM-4 modulation for intra-data center optical interconnects up to 2km: The TERIPHIC project approach

45. Diagnostic accuracy of a new ex vivo confocal laser scanning microscope compared to H&E‐stained paraffin slides for micrographic surgery of basal cell carcinoma.

48. A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain

49. A Gain-Integrated Silicon Photonic Carrier with SOA-Array for Scalable Optical Switch Fabrics

50. Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips

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