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3. Novel Channel-Stress Enhancement Technology with eSiGe S/D and Recessed Channel on Damascene Gate Process

4. Extreme High-Performance n- and p-MOSFETs Boosted by Dual-Metal/High-k Gate Damascene Process using Top-Cut Dual Stress Liners on (100) Substrates

5. A planar transistor for the 32-nm node and beyond with an ultra-shallow junction fabricated using in-situ doped selective Si epitaxy

6. A Promising Planar Transistor with in-situ Doped Selective Si Epitaxy Technology (GORES MOSFET) for 32nm node and beyond

7. Scalable eSiGe S/D Technology with Less Layout Dependence for 45-nm Generation

8. High-Performance and Low-Power CMOS Device Technologies Featuring Metal/High-k Gate Stacks with Uniaxial Strained Silicon Channels on (100) and (110) Substrates

9. A Raised Source/Drain Extension pFET on Si (110) Realized by In-situ Doped Selective Epitaxy Technology

10. Gate Overlapped Raised Extension Structure (GORES) MOSFET by Using In-situ Doped Selective Si Epitaxy

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