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Mg-doped, graded AlGaN films showed the formation of an impurity band and high, temperature-invariant p-conductivity even for doping levels well below the Mott transition. However, compensating point defects disrupted the impurity band, resulting in an Anderson transition from the impurity band to valence band conduction and a more than tenfold reduction in room-temperature conductivity. This is the first demonstration of Anderson-like localization in AlGaN films. [ABSTRACT FROM AUTHOR]

III–V/III-nitride p–n junctions were realized via crystal heterogeneous integration, and the resulting diodes were characterized to analyze electrical behavior and junction quality. p-type In0.53Ga0.47As, which is a well-established base layer in InP heterojunction bipolar transistor (HBT) technology, was used in combination with a homoepitaxial n-type GaN. The latter offers low dislocation density, coupled with high critical electric field and saturation velocity, which are attractive for use in future HBT collector layers. Transmission electron microscopy confirms an abrupt interface in the fabricated heterogeneous diodes. Electrical characterization of the diodes reveals a near-unity ideality factor (n ∼ 1.07) up to 145 °C, a high rectification ratio of ∼108, and a low interface trap density of 3.7 × 1012 cm−2. [ABSTRACT FROM AUTHOR]

High room temperature n-type mobility, exceeding 300 cm2/Vs, was demonstrated in Si-doped AlN. Dislocations and CN−1 were identified as the main compensators for AlN grown on sapphire and AlN single crystalline substrates, respectively, limiting the lower doping limit and mobility. Once the dislocation density was reduced by the growth on AlN wafers, C-related compensation could be reduced by controlling the process supersaturation and Fermi level during growth. While the growth on sapphire substrates supported only high doping ([Si] > 5 × 1018 cm−3) and low mobility (∼20 cm2/Vs), growth on AlN with proper compensation management enabled controlled doping at two orders of magnitude lower dopant concentrations. This work is of crucial technological importance because it enables the growth of drift layers for AlN-based power devices. [ABSTRACT FROM AUTHOR]

Ge doping in AlGaN was studied over a wide dopant concentration range. For high Ge concentrations, the formation of VIII–nGeIII was determined to be the main point defect limiting the conductivity. It was shown that the complex formation could be suppressed by controlling chemical potentials during growth, leading to a higher maximum achievable carrier concentration and selective stabilization of a certain complex type. Chemical potential of the growth species was varied by changing the V/III ratio and growth temperature. Free carrier concentrations as high as 4 × 1019 cm−3 were achieved in Al0.4Ga0.6N:Ge grown on sapphire substrates under "metal-rich" conditions. The ability to control the onset of self-compensation and to stabilize a certain charge state of the compensating defect is of great technological importance for application of AlGaN in various devices. [ABSTRACT FROM AUTHOR]

Contrary to the arsenides where donors undergo stable DX transition, we find that Ge in AlGaN does not suffer from the DX transition; instead, it undergoes a shallow donor (30 meV) to deep donor (150 meV) transition at ∼50% Al content in the alloy. This finding is of profound technological importance as it removes fundamental doping limitations in AlGaN and AlN imposed by the presumed DX−1 acceptor state. The charge state of Ge below and above the transition was determined by co-doping with Si, which remains a shallow donor in AlGaN for up to 80% Al. It was found that Ge occupied a donor state with a (0/+) thermodynamic transition for AlGaN alloys below and above the transition. Ge as a shallow donor was completely ionized at room temperature; however, the ionization of the deep donor required elevated temperatures, commensurate with its higher ionization energy. This behavior is not unique to Ge; preliminary findings show that Si and O in AlGaN may behave similarly. [ABSTRACT FROM AUTHOR]

Based on the experimental dislocation annihilation rates, vacancy core diffusion-controlled dislocation climb was found as a dominant recovery mechanism in high temperature annealing of AlN heteroepitaxial films. Dislocation annihilation mechanisms via dislocation glide (with or without kinks) and vacancy bulk diffusion were found to be less significant. Cross-slip was also ruled out as a possible mechanism as a majority of dislocations in heteroepitaxial AlN films are threading edge dislocations. While dislocation climb through both vacancy bulk and core diffusion could offer a plausible explanation of the recovery process, the activation energy for the vacancy core diffusion-controlled dislocation climb was relatively low (4.3 ± 0.1 eV), as estimated from an Arrhenius plot. The validity of the vacancy core diffusion mechanism was also supported by a large vacancy mean free path (∼240 nm), which was comparable to the sample thickness and thus the average dislocation length. Finally, the experimentally observed dislocation density reduction as a function of the annealing temperature and time was in good agreement with the vacancy core diffusion mechanism. [ABSTRACT FROM AUTHOR]

Reduction in compensation in Si-doped Al-rich AlGaN is demonstrated via chemical potential control (CPC). The chemical potentials and the resulting formation energies of carbon on the nitrogen site (CN) and cation vacancy complex with Si (VIII + nSiIII) were related to growth variables through a thermodynamic supersaturation model, which quantitatively predicted the incorporation of CN and the generation of the VIII + nSiIII complex. The compensation "knee" behavior, i.e., decreasing conductivity with increasing Si incorporation beyond a certain concentration, was successfully controlled. The maximum free carrier concentration was improved by impeding the formation of VIII + nSiIII complexes under III-richer conditions, while the impurity compensation by CN was reduced by making the growth environment N-richer. The results of Hall effect measurement and photoluminescence agreed well with quantitative theoretical predictions of the CPC model. Based on the developed model, the highest conductivity of 160 Ω−1 cm−1 with free carrier concentration of 3 × 1019 cm−3 in Al0.7Ga0.3N ever reported was achieved on single crystal AlN substrates. The demonstrated predictive power of the CPC model should greatly reduce the empirical analysis or iterative experimentation that would otherwise be necessary. [ABSTRACT FROM AUTHOR]

The influence of the polarization field on the emission properties of the AlGaN-based quantum structures grown on AlN substrates was investigated as a function of well width, barrier width, and barrier height. A thin AlGaN well and a thin AlN barrier design reduced the polarization field to ∼0.5 MV/cm, resulting in an ultralow laser threshold of 3 kW/cm2 in an optically pumped configuration. These experimental results were used to validate the simulation. In the next step, a structure with Al0.7Ga0.3N barriers was designed to support carrier injection with a minimal loss in optical performance. This structure showed a threshold of 7 kW/cm2 under optical pumping and an estimated threshold current of 8 kA/cm2 for the electric injection. [ABSTRACT FROM AUTHOR]

Heteroepitaxial crystallographic tilt has been investigated as a possible strain‐relief mechanism in Al‐rich (Al>50%) AlGaN heteroepitaxial layers grown on single‐crystal (0001) AlN substrates with varying miscuts from 0.05° to 4.30°. The magnitude of the elastic lattice deformation‐induced tilt increases monotonically with the miscut angle, tightly following the Nagai tilt model. Although tilt angles as high as 0.1° are recorded, reciprocal space mapping (RSM) broadening and wafer bow measurements do not show any significant changes as a function of the heteroepitaxial tilt angle. While crystallographic tilting has been shown to be effective in controlling strain in some other heteroepitaxial systems, it does not provide any appreciable strain relief of the compressive strain in AlGaN/AlN heteroepitaxy. [ABSTRACT FROM AUTHOR]

A thermodynamic supersaturation model for growth of AlGaN by metalorganic chemical vapor deposition was developed for experimentally accessible growth parameters. The derived non-linear relationships enabled us to estimate Ga and Al supersaturation during AlGaN growth for given growth conditions. Calculations revealed that the GaN phase was close to chemical equilibrium, while the Al supersaturation was as high as 1010 for typical growth conditions. Such a disparity in the supersaturation of reaction species plays a significant role in the stability of the growth of the resulting ternary alloy. The agreement between experiment and simulation suggests that the parasitic gas phase reactions between trimethylaluminum and NH3 were not significant at low NH3 flow rates/partial pressures, indicating that, under these conditions, the AlGaN growth was thermodynamically limited. [ABSTRACT FROM AUTHOR]

A theoretical framework that provides a quantitative relationship between point defect formation energies and growth process parameters is presented. It enables systematic point defect reduction by chemical potential control in metalorganic chemical vapor deposition (MOCVD) of III-nitrides. Experimental corroboration is provided by a case study of C incorporation in GaN. The theoretical model is shown to be successful in providing quantitative predictions of CN defect incorporation in GaN as a function of growth parameters and provides valuable insights into boundary phases and other impurity chemical reactions. The metal supersaturation is found to be the primary factor in determining the chemical potential of III/N and consequently incorporation or formation of point defects which involves exchange of III or N atoms with the reservoir. The framework is general and may be extended to other defect systems in (Al)GaN. The utility of equilibrium formalism typically employed in density functional theory in predicting defect incorporation in non-equilibrium and high temperature MOCVD growth is confirmed. Furthermore, the proposed theoretical framework may be used to determine optimal growth conditions to achieve minimum compensation within any given constraints such as growth rate, crystal quality, and other practical system limitations. [ABSTRACT FROM AUTHOR]