1. Process Innovations for Future Technology Nodes with Back-Side Power Delivery and 3D Device Stacking
- Author
-
Kobrinsky, M., primary, Silva, J. D, additional, Mannebach, E., additional, Mills, S., additional, El Qader, M. Abd, additional, Adebayo, O., additional, Radhakrishna, N. Arkali, additional, Beasley, M., additional, Chawla, J., additional, Chugh, S., additional, Clinton, E., additional, Dasgupta, A., additional, Desai, U., additional, De Re, E., additional, Dewey, G., additional, Edwards, T., additional, Engel, C., additional, Galatage, R., additional, Ghani, T., additional, Gudmundsson, V., additional, Hibbeler, L., additional, Hicks, J., additional, Krist, B., additional, Mehandru, R., additional, Meric, I., additional, Morrow, P., additional, Nandi, D., additional, Pantuso, D., additional, Patel, P., additional, Pawashe, C., additional, Radosavljevic, M., additional, Ramamurthy, R., additional, Samanta, D., additional, Cekli, S., additional, Shoer, L., additional, Amour, A. St, additional, Tan, L. H., additional, Yemenicioglu, S., additional, Wang, X., additional, and Wiedemer, J. A., additional
- Published
- 2023
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