17 results on '"Marco Rovitto"'
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2. Impact of Viscoelastic Properties on Package Warpage Prediction
3. Thermal Aging on Molding Compounds: Material Characterization and Modeling
4. Simulation of Moisture Ingression Ingression in Microelectronics Package to Correlate Accelerated Tests and Field Conditions Reliability
5. Material Characterization and Modelling for Chip Encapsulation Simulation
6. Transfer Molding Simulation to Predict Filling Flaws and Optimize Package Design
7. Die Thickness Optimization for Preventing Electro-Thermal Fails Induced by Solder Voids in Power Devices
8. A Complete Explanation of Warpage Behavior Across Backend Processes on Organic BGA in Strip Form and its Predictive Methodology
9. Dynamic Warpage Analysis of QFP Packages During Soldering Reflow Process and Thermal Cycle
10. BGA strip warpage induced by assembly process and the practical prediction methodology
11. Novel methodology for real time thermal expansion characterization on ball grid array substrate stack-up materials
12. Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon Vias
13. Mechanical Effects of the Volmer-Weber Growth in the TSV Sidewall
14. Impact of microstructure and current crowding on electromigration: A TCAD study
15. Analysis of electromigration void nucleation failure time in open copper TSVs
16. Electromigration modelling of void nucleation in open Cu-TSVs
17. Electromigration in solder bumps: A mean-time-to-failure TCAD study
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