676 results on '"Lu, Xinchun"'
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2. Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing
3. Impact of combined organic amendments and chemical fertilizers on soil microbial limitations, soil quality, and soybean yield
4. Publisher Correction to: Computational investigation of a novel metal thickness measurement system with coaxial triple‑coil sensor for chemical mechanical polishing
5. Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
6. Polishing mechanisms of various surfactants in chemical mechanical polishing relevant to cobalt interconnects
7. Enhancing ceria slurry performance for shallow trench isolation chemical mechanical polishing through non-ionic surfactant addition
8. Microbial Responses of Soil Fertility to Depth of Tillage and Incorporation of Straw in a Haplic Chernozem in Northeast China
9. Evaluation of the soil aggregate stability under long term manure and chemical fertilizer applications: Insights from organic carbon and humic acid structure in aggregates
10. Response of soil enzymatic activity to pore structure under inversion tillage with organic materials incorporation in a Haplic Chernozem
11. Application of organic manure as a potential strategy to alleviate the limitation of microbial resources in soybean rhizospheric and bulk soils
12. An efficient solution based on the synergistic effects of nickel foam in NiFe-LDH nanosheets for oil/water separation
13. Research on weakly alkaline bulk slurries relevant to chemical mechanical polishing for cobalt interconnects
14. Cutting speed dependence of material removal mechanism for monocrystal silicon
15. An efficient anti-fouling strategy involving in-situ aeration and dielectrophoresis by using high salinity seawater for oily wastewater treatment
16. Advance of self-cleaning separation membranes for oil-containing wastewater treatment
17. Prediction and measurement for grinding force in wafer self-rotational grinding
18. Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process
19. Temporal dynamics of density separated soil organic carbon pools as revealed by δ13C changes under 17 years of straw return
20. Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing
21. Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon
22. The role of dipotassium ethylenediaminetetraacetic acid and potassium oleate on chemical mechanical planarization relevant to heterogeneous materials of cobalt interconnects
23. Non-contact Post-CMP megasonic cleaning of cobalt wafers
24. Durable Nano‐Flower Structured Foam Coupled with Electrically‐Driven in Situ Aeration Enable High‐Flux Oil/Water Emulsion Separation with Dynamic Antifouling Ability
25. Knockdown of hsa_circ_0001964 inhibits hepatocellular carcinoma cell proliferation by inactivating PI3K/AKT signaling pathway
26. Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD
27. Effects of wheel spindle vibration on surface formation in wafer self-rotational grinding process
28. Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process
29. The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
30. The role of carboxylic acids on nanoparticle removal in post CMP cleaning process for cobalt interconnects
31. All-Solution-Processed Electronics with Sub-Microscale Resolution and Nanoscale Fidelity Fabricated Via a Humidity-Controlled, Surface Energy-Directed Assembly Process.
32. Land Degradation Affects Soil Microbial Properties, Organic Matter Composition, and Maize Yield.
33. Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy
34. Inversion Tillage Combined with Organic Fertilizer Application Increased Maize Yield via Improving Soil Pore Structure and Enzymatic Activity in Haplic Chernozem.
35. RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis
36. Corrosion- and wear-resistant composite film of graphene and mussel adhesive proteins on carbon steel
37. Developing an Efficient Forward Design Method for Co Post-CMP Cleaning Formulations Based on Nanoparticle Removal Mechanisms
38. Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing
39. An efficient anti-fouling strategy involving in-situ aeration and dielectrophoresis by using high salinity seawater for oily wastewater treatment
40. Effect of ionic surfactants on shallow trench isolation for chemical mechanical polishing using ceria-based slurries
41. Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters
42. Cutting speed dependence of material removal mechanism for monocrystal silicon
43. Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers
44. Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process
45. The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning
46. Mechanical model of single abrasive during chemical mechanical polishing: Molecular dynamics simulation
47. Numerical investigation of wafer drying induced by the thermal Marangoni effect
48. A Review of Capacity Allocation and Control Strategies for Electric Vehicle Charging Stations with Integrated Photovoltaic and Energy Storage Systems.
49. Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing
50. Effects of Organic Materials and Their Incorporation Depths on Humus Substances Structure and Soil Microbial Communities’ Characteristics in a Chinese Mollisol
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