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3. Clinical Evaluation of Scout Accelerated Motion Estimation and Reduction Technique for 3D MR Imaging in the Inpatient and Emergency Department Settings

9. Development of Highly Manufacturable, Reliable, and Energy-Efficient Spin-Orbit Torque Magnetic Random Access Memory (SOT-MRAM)

13. Evaluation of Ultrafast Wave–Controlled Aliasing in Parallel Imaging 3D-FLAIR in the Visualization and Volumetric Estimation of Cerebral White Matter Lesions

14. Heterogeneous contributions of change in population distribution of body mass index to change in obesity and underweight

15. Evaporation Pressure Control on High Crystallization Perovskite Layer via Sandwich Evaporation Technique

20. 3D Scalable, Wake-up Free, and Highly Reliable FRAM Technology with Stress-Engineered HfZrOx

25. Simulation of thickness effect in thin ferroelectric films using Landau–Khalatnikov theory.

26. Consolidation in Unsaturated Soils with Body Forces

27. Effects of diabetes definition on global surveillance of diabetes prevalence and diagnosis : a pooled analysis of 96 population-based studies with 331288 participants

28. Acoustic Noise Radiated by PWM-Controlled Induction Machine Drives

29. Morphology and electrical conduction of Si:P δ-doped layers on vicinal Si(001).

30. Effects of comorbidity and medication use on the haemodynamic status during office‐based laryngeal procedures: A prospective cohort study.

35. Process integration for backside illuminated image sensor stacked with Analog-to-Digital Conversion chip

45. Structural design, process, and reliability of a wafer-level 3D integration scheme with Cu TSVs based on micro-bump/adhesive hybrid wafer bonding

49. Cu-based bonding technology for 3D integration applications

50. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)

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