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22 results on '"Lin, Wen-Fei"'

3. Fungal diversity notes 1387–1511: taxonomic and phylogenetic contributions on genera and species of fungal taxa

Author

Boonmee, Saranyaphat, Wanasinghe, Dhanushka N., Calabon, Mark S., Huanraluek, Naruemon, Chandrasiri, Sajini K. U., Jones, Gareth E. B., Rossi, Walter, Leonardi, Marco, Singh, Sanjay K., Rana, Shiwali, Singh, Paras N., Maurya, Deepak K., Lagashetti, Ajay C., Choudhary, Deepika, Dai, Yu-Cheng, Zhao, Chang-Lin, Mu, Yan-Hong, Yuan, Hai-Sheng, He, Shuang-Hui, Phookamsak, Rungtiwa, Jiang, Hong-Bo, Martín, María P., Dueñas, Margarita, Telleria, M. Teresa, Kałucka, Izabela L., Jagodziński, Andrzej M., Liimatainen, Kare, Pereira, Diana S., Phillips, Alan J. L., Suwannarach, Nakarin, Kumla, Jaturong, Khuna, Surapong, Lumyong, Saisamorn, Potter, Tarynn B., Shivas, Roger G., Sparks, Adam H., Vaghefi, Niloofar, Abdel-Wahab, Mohamed A., Abdel-Aziz, Faten A., Li, Guo-Jie, Lin, Wen-Fei, Singh, Upendra, Bhatt, Rajendra P., Lee, Hyang Burm, Nguyen, Thuong T. T., Kirk, Paul M., Dutta, Arun Kumar, Acharya, Krishnendu, Sarma, V. Venkateswara, Niranjan, M., Rajeshkumar, Kunhiraman C., Ashtekar, Nikhil, Lad, Sneha, Wijayawardene, Nalin N., Bhat, Darbe J., Xu, Rong-Ju, Wijesinghe, Subodini N., Shen, Hong-Wei, Luo, Zong-Long, Zhang, Jing-Yi, Sysouphanthong, Phongeun, Thongklang, Naritsada, Bao, Dan-Feng, Aluthmuhandiram, Janith V. S., Abdollahzadeh, Jafar, Javadi, Alireza, Dovana, Francesco, Usman, Muhammad, Khalid, Abdul Nasir, Dissanayake, Asha J., Telagathoti, Anusha, Probst, Maraike, Peintner, Ursula, Garrido-Benavent, Isaac, Bóna, Lilla, Merényi, Zsolt, Boros, Lajos, Zoltán, Bratek, Stielow, J. Benjamin, Jiang, Ning, Tian, Cheng-Ming, Shams, Esmaeil, Dehghanizadeh, Farzaneh, Pordel, Adel, Javan-Nikkhah, Mohammad, Denchev, Teodor T., Denchev, Cvetomir M., Kemler, Martin, Begerow, Dominik, Deng, Chun-Ying, Harrower, Emma, Bozorov, Tohir, Kholmuradova, Tutigul, Gafforov, Yusufjon, Abdurazakov, Aziz, Xu, Jian-Chu, Mortimer, Peter E., Ren, Guang-Cong, Jeewon, Rajesh, Maharachchikumbura, Sajeewa S. N., Phukhamsakda, Chayanard, Mapook, Ausana, and Hyde, Kevin D.

Published
2021
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10. Morphological and Phylogenetic Evidences Reveal Four New Species of Cantharellus Subgenus Cantharellus (Hydnaceae, Cantharellales) From China

Author

Zhang, Yu-Zhuo, Lin, Wen-Fei, Buyck, Bart, Liang, Zhi-Qun, Su, Ming-Sheng, Chen, Zuo-Hong, Zhang, Ping, Jiang, Shuai, An, Dong-Yu, and Zeng, Nian-Kai

Subjects
Microbiology (medical), Microbiology
Abstract

Species of Cantharellus subgenus Cantharellus are interesting and important for their mycorrhizal properties, medicinal values, and edibility. In China, there are many undescribed species of the subgenus. In this study, four new species of subg. Cantharellus, viz. Cantharellus albopileatus, Cantharellus chuiweifanii, Cantharellus pinetorus, and Cantharellus ravus from Hainan and Hunan Provinces, respectively, were described based on morphological and phylogenetic evidence as a contribution to the knowledge of the species diversity in China. Detailed descriptions, color photographs of fresh basidiomata, and line drawings of microstructures of these four new species are presented as well as comparisons with related species.

Published
2022

19. Reduction of Residual Stresses in Sapphire Cover Glass Induced by Mechanical Polishing and Laser Chamfering Through Etching

Author

Wu, Shih-Jeh, Hsu, Hsiang-Chen, Lin, Wen-Fei, Wu, Shih-Jeh, Hsu, Hsiang-Chen, and Lin, Wen-Fei

Abstract

Sapphire is a hard and anti-scratch material commonly used as cover glass of mobile devices such as watches and mobile phones. A mechanical polishing using diamond slurry is usually necessary to create mirror surface. Additional chamfering at the edge is sometimes needed by mechanical grinding. These processes induce residual stresses and the mechanical strength of the sapphire work piece is impaired. In this study wet etching by phosphate acid process is applied to relief the induced stress in a 1” diameter sapphire cover glass. The sapphire is polished before the edge is chamfered by a picosecond laser. Residual stresses are measured by laser curvature method at different stages of machining. The results show that the wet etching process effectively relief the stress and the laser machining does not incur serious residual stress.

Published
2016

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