400 results on '"Lee, Choong-Jae"'
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2. Controlling the Dissolution Behavior of (Meth)acrylate-Based Photoresist Polymers in Tetramethylammonium Hydroxide by Introducing Adamantyl Groups.
3. Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu[sbnd]Ni bonding
4. Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test
5. Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
6. Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi
7. Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)
8. Design and analysis of Cu circuit for stretchable electronic circuits using finite element analysis
9. Swelling Behavior of Acrylate-Based Photoresist Polymers Containing Cycloaliphatic Groups of Various Sizes.
10. Bending reliability of Ni–MWCNT composite solder with a differential structure
11. Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering
12. Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test
13. Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test
14. Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests
15. Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment
16. Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability
17. Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding
18. The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature
19. Electromigration Behavior of Cu Core Solder Joints Under High Current Density
20. Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding
21. Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process
22. Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package
23. The effect of pH on synthesizing Ni-decorated MWCNTs and its application for Sn-58Bi solder
24. Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints
25. Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics
26. Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant
27. Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB
28. Enhancing adhesion strength of photonic sintered screen-printed Ag circuit by atmospheric pressure plasma
29. Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy
30. Effect of SDBS on the oxidation reliability of screen-printed Cu circuits
31. Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions
32. Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder
33. Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications
34. Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder
35. Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles
36. Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method
37. Pyunkang-hwan (Pyunkang-tang) ameliorates air pollutant-induced inflammatory hypersecretion of airway mucus and bleomycin-induced pulmonary fibrosis in rats
38. Verticine, ebeiedine and suchengbeisine isolated from the bulbs of Fritillaria thunbergii Miq. inhibited the gene expression and production of MUC5AC mucin from human airway epithelial cells
39. The JAK2/STAT3/CCND2 Axis promotes colorectal Cancer stem cell persistence and radioresistance
40. Regulation of the Gene Expression of Airway MUC5AC Mucin through NF-κB Signaling Pathway by Artesunate, an Antimalarial Agent
41. Searching for Novel Candidate Small Molecules for Ameliorating Idiopathic Pulmonary Fibrosis: a Narrative Review
42. Meclofenamate Suppresses MUC5AC Mucin Gene Expression by Regulating the NF-kB Signaling Pathway in Human Pulmonary Mucoepidermoid NCI-H292 Cells
43. Supplementary Figures and Tables from Inhibition of LEF1-Mediated DCLK1 by Niclosamide Attenuates Colorectal Cancer Stemness
44. SEC22B inhibition attenuates colorectal cancer aggressiveness and autophagic flux under unfavorable environment
45. Dioscin and methylprotodioscin isolated from the root of Asparagus cochinchinensis suppressed the gene expression and production of airway MUC5AC mucin induced by phorbol ester and growth factor
46. Luteolin inhibited the gene expression, production and secretion of MUC5AC mucin via regulation of nuclear factor kappa B signaling pathway in human airway epithelial cells
47. Effects of the root of Platycodon grandiflorum on airway mucin hypersecretion in vivo and platycodin D3 and deapi-platycodin on production and secretion of airway mucin in vitro
48. Effects of ophiopogonin D and spicatoside A derived from Liriope Tuber on secretion and production of mucin from airway epithelial cells
49. Machine learning with in silico analysis markedly improves survival prediction modeling in colon cancer patients
50. Betulin, an Anti-Inflammatory Triterpenoid Compound, Regulates MUC5AC Mucin Gene Expression through NF-kB Signaling in Human Airway Epithelial Cells
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