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568 results on '"Lee, Chang-Chun"'

1. Vaccination induces broadly neutralizing antibody precursors to HIV gp41

Author

Schiffner, Torben, Phung, Ivy, Ray, Rashmi, Irimia, Adriana, Tian, Ming, Swanson, Olivia, Lee, Jeong Hyun, Lee, Chang-Chun D., Marina-Zárate, Ester, Cho, So Yeon, Huang, Jiachen, Ozorowski, Gabriel, Skog, Patrick D., Serra, Andreia M., Rantalainen, Kimmo, Allen, Joel D., Baboo, Sabyasachi, Rodriguez, Oscar L., Himansu, Sunny, Zhou, Jianfu, Hurtado, Jonathan, Flynn, Claudia T., McKenney, Katherine, Havenar-Daughton, Colin, Saha, Swati, Shields, Kaitlyn, Schultze, Steven, Smith, Melissa L., Liang, Chi-Hui, Toy, Laura, Pecetta, Simone, Lin, Ying-Cing, Willis, Jordan R., Sesterhenn, Fabian, Kulp, Daniel W., Hu, Xiaozhen, Cottrell, Christopher A., Zhou, Xiaoya, Ruiz, Jennifer, Wang, Xuesong, Nair, Usha, Kirsch, Kathrin H., Cheng, Hwei-Ling, Davis, Jillian, Kalyuzhniy, Oleksandr, Liguori, Alessia, Diedrich, Jolene K., Ngo, Julia T., Lewis, Vanessa, Phelps, Nicole, Tingle, Ryan D., Spencer, Skye, Georgeson, Erik, Adachi, Yumiko, Kubitz, Michael, Eskandarzadeh, Saman, Elsliger, Marc A., Amara, Rama R., Landais, Elise, Briney, Bryan, Burton, Dennis R., Carnathan, Diane G., Silvestri, Guido, Watson, Corey T., Yates, III, John R., Paulson, James C., Crispin, Max, Grigoryan, Gevorg, Ward, Andrew B., Sok, Devin, Alt, Frederick W., Wilson, Ian A., Batista, Facundo D., Crotty, Shane, and Schief, William R.

Published
2024
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2. Affinity gaps among B cells in germinal centers drive the selection of MPER precursors

Author

Ray, Rashmi, Schiffner, Torben, Wang, Xuesong, Yan, Yu, Rantalainen, Kimmo, Lee, Chang-Chun David, Parikh, Shivang, Reyes, Raphael A., Dale, Gordon A., Lin, Ying-Cing, Pecetta, Simone, Giguere, Sophie, Swanson, Olivia, Kratochvil, Sven, Melzi, Eleonora, Phung, Ivy, Madungwe, Lisa, Kalyuzhniy, Oleksandr, Warner, John, Weldon, Stephanie R., Tingle, Ryan, Lamperti, Edward, Kirsch, Kathrin H., Phelps, Nicole, Georgeson, Erik, Adachi, Yumiko, Kubitz, Michael, Nair, Usha, Crotty, Shane, Wilson, Ian A., Schief, William R., and Batista, Facundo D.

Published
2024
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3. Author Correction: Vaccination induces broadly neutralizing antibody precursors to HIV gp41

Author

Schiffner, Torben, Phung, Ivy, Ray, Rashmi, Irimia, Adriana, Tian, Ming, Swanson, Olivia, Lee, Jeong Hyun, Lee, Chang-Chun D., Marina-Zárate, Ester, Cho, So Yeon, Huang, Jiachen, Ozorowski, Gabriel, Skog, Patrick D., Serra, Andreia M., Rantalainen, Kimmo, Allen, Joel D., Baboo, Sabyasachi, Rodriguez, Oscar L., Himansu, Sunny, Zhou, Jianfu, Hurtado, Jonathan, Flynn, Claudia T., McKenney, Katherine, Havenar-Daughton, Colin, Saha, Swati, Shields, Kaitlyn, Schultze, Steven, Smith, Melissa L., Liang, Chi-Hui, Toy, Laura, Pecetta, Simone, Lin, Ying-Cing, Willis, Jordan R., Sesterhenn, Fabian, Kulp, Daniel W., Hu, Xiaozhen, Cottrell, Christopher A., Zhou, Xiaoya, Ruiz, Jennifer, Wang, Xuesong, Nair, Usha, Kirsch, Kathrin H., Cheng, Hwei-Ling, Davis, Jillian, Kalyuzhniy, Oleksandr, Liguori, Alessia, Diedrich, Jolene K., Ngo, Julia T., Lewis, Vanessa, Phelps, Nicole, Tingle, Ryan D., Spencer, Skye, Georgeson, Erik, Adachi, Yumiko, Kubitz, Michael, Eskandarzadeh, Saman, Elsliger, Marc A., Amara, Rama R., Landais, Elise, Briney, Bryan, Burton, Dennis R., Carnathan, Diane G., Silvestri, Guido, Watson, Corey T., Yates, III, John R., Paulson, James C., Crispin, Max, Grigoryan, Gevorg, Ward, Andrew B., Sok, Devin, Alt, Frederick W., Wilson, Ian A., Batista, Facundo D., Crotty, Shane, and Schief, William R.

Published
2024
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5. Neural Architecture Search for Inversion

Author

Zhan, Cheng, Zhang, Licheng, Zhao, Xin, Lee, Chang-Chun, and Huang, Shujiao

Subjects
Computer Science - Machine Learning
Abstract

Over the year, people have been using deep learning to tackle inversion problems, and we see the framework has been applied to build relationship between recording wavefield and velocity (Yang et al., 2016). Here we will extend the work from 2 perspectives, one is deriving a more appropriate loss function, as we now, pixel-2-pixel comparison might not be the best choice to characterize image structure, and we will elaborate on how to construct cost function to capture high level feature to enhance the model performance. Another dimension is searching for the more appropriate neural architecture, which is a subset of an even bigger picture, the automatic machine learning, or AutoML. There are several famous networks, U-net, ResNet (He et al., 2016) and DenseNet (Huang et al., 2017), and they achieve phenomenal results for certain problems, yet it's hard to argue they are the best for inversion problems without thoroughly searching within certain space. Here we will be showing our architecture search results for inversion.

Published
2022

20. Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules

Author

Lee, Chang-Chun, Kao, Kuo-Shu, and Huang, Yuan-Cheng

Abstract

Meeting both high-frequency and high-speed requirements is essential, and the small form factor designs for the architecture of high-powered modules are acknowledged to impact their reliability in subsequent applications. However, conventional power modules utilizing a direct bonded copper substrate still encounter warpage issues stemming from the manufacturing process. This results in suboptimal heat dissipation after heat sink assembly, leading to a failure to meet automotive specifications for high voltage and high current resistance. To address this concern, our research proposes a thin and low warpage power module with an insulating metal substrate and a thermal interface material structural design. This aims to enhance heat dissipation capacity while maintaining low warpage and ensuring high mechanical reliability. The study employs coupling simulation technology integrating a process-oriented approach with a follow-up automotive specification power cycle reliability test. This allows for estimation of the warpage behavior caused by the power module process and the mechanical response of the solder layer within the module. To validate the accuracy and credibility of the simulation results, actual vehicle fabrication and related power cycling experiments are conducted. Furthermore, an improvement solution for the power module is proposed to offer a high industrial competitiveness of the long-term packaging reliability.

Published
2024
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30. Influenza A surface glycosylation and vaccine design

Author

Wu, Chung-Yi, Lin, Chih-Wei, Tsai, Tsung-I, Lee, Chang-Chun David, Chuang, Hong-Yang, Chen, Jhih-Bin, Tsai, Ming-Hung, Chen, Bo-Rui, Lo, Pei-Wen, Liu, Chiu-Ping, Shivatare, Vidya S., and Wong, Chi-Huey

Published
2017

36. A Novel Polymer-Based Ultra-High Density Bonding Interconnection

Author

Lin, Yu-Min, primary, Yang, Tsung-Yu Ou, additional, Lee, Ou-Hsiang, additional, Lee, Ching- Kuan, additional, Ko, Hsiu-Kuei, additional, Chen, Yi-Shu, additional, Chang, Hsiang-Hung, additional, Gallagher, Michael, additional, Gilmore, Christopher, additional, Chuang, Po-Yao, additional, Tseng, Ying-Chung, additional, Tsai, Po-Hao, additional, Huang, Po-Chun, additional, and Lee, Chang-Chun, additional

Published
2023
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48. Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module

Author

Lee, Chang-Chun, Wang, Chi-Wei, Syu, Ji-Yuan, and Tsai, Wei-Cheng

Abstract

Although the power module has been developed and used for decades, the effects of large deformation and residual stress during the manufacturing process remain as critical issues. These issues also affect the reliability of a power module. Therefore, a process-oriented simulation methodology based on the finite element method is proposed to estimate warpage variation and residual stress during the process of a power module. The mechanical behavior of the thermal cycling test (TCT) is estimated in accordance with the deformation and residual stress from the process. The chemical shrinkage characteristic of the molding material is included in the simulation due to the large deformation of the molding process. The warpage of the power module from the experiment is measured during the process to verify the simulation methodology. Experimental measurements of the major procedures, including prebending, reflow, housing, and molding, of the power module, are conducted in sequence. Warpage error between the experiment and the simulation during the process is less than 5%. The effects of residual stress and deformation from the process are subsequently considered for TCT to investigate the effects on the corresponding mechanical behavior. In addition, static electrical and insulation characteristics are measured. The measured results of the insulation voltage reveal that the aluminum nitride (AlN) ceramic layer fails due to cracking between 150 and 250 cycles, verifying the prediction of the simulated results on the basis of the first principle stress of ceramic. Moreover, the failure of the ceramic is observed with scanning acoustic tomography. The simulation results compare the effects of deformation and residual stress from the manufacturing process. The simulation result that has not considered the process shows that the ceramic fails immediately at the first cycle of TCT. This finding is inconsistent with the experiment results. The results indicated that the effect of the manufacturing process should be considered when estimating the mechanical behavior for the subsequent reliability test.

Published
2024
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49. Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration

Author

Lee, Chang-Chun, Chang, Che-Pei, and Huang, Pei-Chen

Abstract

With the advantage of high I/O amount, thin substrate, and superior heterogeneous integration ability, fan-out panel-level packaging (FO-PLP) has become a major platform for the future design of advanced electronic packaging. Despite the enlarged area of the panel-level package and quadrilateral structure, the expected usage ratio of the panel platform is better than the traditional wafer platform. However, an enlarged structural dimension also causes the harsh warpage issue during the fabrication and assembly procedure for the concerned packaging. The aforementioned process-induced warpage is regarded as an urgent reliability issue and must be solved for the FO-PLP vehicle. To estimate the induced stress among structures, process conditions are important factors to interpolate the process-dependent stress in simulation. In the aforementioned process-oriented simulation work, the significant scale mismatch issue in an FO-PLP vehicle causes the difficulty in mesh gridding and the model becomes discontinuous after the sawing process from panel to stripe. In this research, the multilevel warpage simulation methodology is demonstrated with a redistribution layer (RDL) first FO-PLP vehicle. The equivalent material method is utilized to conquer the modeling complexity on fine RDL and micro-bump. The estimated warpage from finite element analysis (FEA) is verified with the measured warpage from the experiment for two process steps, panel and stripe levels. The presented methodology for FEA also indicates the same results as the experiment. The warpage error between the simulation and experiment is below 5%. Accordingly, the presented simulation methodology is validated, which can be utilized to estimate the FO-PLP warpage. The factor and material for the process can be further optimized on the basis of the proposed methodology with FEA.

Published
2023
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