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The semiconductor gallium nitride is the material at the centre of energy-efficient solid-state lighting and is becoming increasingly important in high-power and high-frequency electronics. Reducing the dislocation density of gallium nitride planar layers is important for improving the performance and reliability of devices, such as light-emitting diodes and high-electron-mobility transistors. The patterning of selective growth masks is one technique for forcing a three-dimensional growth mode in order to control the propagation of threading defects to the active device layers. The morphology of the three-dimensional growth front is determined by the relative growth rates of the different facets that are formed, and for GaN is typically limited by the slow-growing {1 −1 0 1} facets. We demonstrate how the introduction of nanodash growth windows can be oriented in an array to preserve fast-growing {1 1 −2 2} facets at the early stage of growth to accelerate coalescence of three-dimensional structures into a continuous GaN layer. Cathodoluminescence and Electron Channelling Contrast Imaging methods, both used to measure the threading dislocation density, reveal that the dislocations are organised and form a distinctive pattern according to the underlying mask. By optimising the arrangement of nanodashes and the nanodash density, the threading dislocation density of GaN on sapphire epilayers can be reduced significantly from 109 cm−2 to 3.0 × 107 cm−2. Raman spectroscopy, used to monitor the strain in the overgrown GaN epilayers, shows that the position of the GaN E2H phonon mode peak was reduced as the dash density increases for a sample grown via pendeo-epitaxy whilst no obvious change was recorded for a sample grown via more conventional epitaxial lateral overgrowth. These results show how growth mask design can be used to circumvent limitations imposed by the growth dynamics. Moreover, they have revealed a greater understanding of the influence of the growth process on the dislocation density which will lead to higher performing electronic and optoelectronic devices as a result of the lower dislocation densities achieved.

Displacement Talbot lithography (DTL) is a new technique for patterning large areas with sub-micron periodic features with low cost. It has applications in fields that cannot justify the cost of deep-UV photolithography, such as plasmonics, photonic crystals, and metamaterials and competes with techniques, such as nanoimprint and laser interference lithography. It is based on the interference of coherent light through a periodically patterned photomask. However, the factors affecting the technique’s resolution limit are unknown. Through computer simulations, we show the mask parameter’s impact on the features’ size that can be achieved and describe the separate figures of merit that should be optimized for successful patterning. Both amplitude and phase masks are considered for hexagonal and square arrays of mask openings. For large pitches, amplitude masks are shown to give the best resolution; whereas, for small pitches, phase masks are superior because the required exposure time is shorter. We also show how small changes in the mask pitch can dramatically affect the resolution achievable. As a result, this study provides important information for choosing new masks for DTL for targeted applications.

GaN/InGaN core–shell nanorods are promising for optoelectronic applications due to the absence of polarization-related electric fields on the sidewalls, a lower defect density, a larger emission volume, and strain relaxation at the free surfaces. The core–shell geometry allows the growth of thicker InGaN shell layers, which would improve the efficiency of light emitting diodes. However, the growth mode of such layers by metal organic vapor phase epitaxy is poorly understood. Through a combination of nanofabrication, epitaxial growth, and detailed characterization, this work reveals an evolution in the growth mode of InGaN epitaxial shells, from a two-dimensional (2D) growth mode to three-dimensional (3D) striated growth without additional line defect formation with increasing layer thickness. Measurements of the indium distribution show fluctuations along the directions, with low and high indium composition associated with the 2D and 3D growth modes, respectively. Atomic steps at the GaN/InGaN core–shell interface were observed to occur with a similar frequency as quasi-periodic indium fluctuations along [0001] observed within the 2D layer, to provide evidence that the resulting local strain relief at the steps acts as the trigger for a change of growth mode by elastic relaxation. This study demonstrates that misfit dislocation generation during the growth of wider InGaN shell layers can be avoided by using pre-etched GaN nanorods. Significantly, this enables the growth of absorption-based devices and light-emitting diodes with emissive layers wide enough to mitigate efficiency droop.

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New materials are needed to decrease cost and improve photovoltaic cell performance. These thesis works are focused on the development of new titanium oxide phases for transparent electronic and photon conversion applied to silicon solar cell. Pulsed laser deposition is an adapted growth method for the prospection of materials with innovating properties. The control of epitaxial growth of anatase, rutile and a phase with a composition TiO1.45 in function of oxygen partial pressure allowed us to realize films with innovating electrical and optical properties. A two phase anatase/rutile film doped niobium (TNO1.80) have shown a metal-semiconductor transition about 68 K. Moreover, transparent TiO1.45 epitaxial thin film has displayed a p-type semiconduction behaviour which has been confirmed by the elaboration of a transparent p - n homojunction. Rutile and anatase titanium oxide matrix were also used to host rare earths ions in order to convert ultraviolet to near infra-red photon (800 > λ > 1100 nm). TiO2 matrix to dopant transfer has been studied in function of crystal structure, doping content and the quality of microstructure of films doped Ln3+(Ln3+=Pr3+,Tm3+,Eu3+,Yb3+,Nd3+)., Le photovoltaïque nécessite de nouveaux matériaux pour diminuer ces coûts et améliorer les rendements. Ces travaux de thèse ont concerné le développement de nouvelles phases d'oxyde de titane pour l'électronique transparente et la conversion de photon appliquée au PV silicium. L'ablation laser pulsé est une méthode de croissance particulièrement adaptée pour la prospection de matériaux aux propriétés innovantes. Le contrôle des phases anatase, rutile et d'une phase de composition TiO1.45 épitaxié en fonction de la pression partielle d'oxygène a permis de réaliser des films aux propriétés électriques, optiques innovantes. Un film biphasé anatase/rutile dopé niobium (TNO1.80) présente ainsi une transition métal-semi-conducteur aux alentours de 68K. Par ailleurs, le film de composition TiO1.45 épitaxié s'est révélé être un oxyde transparent conducteur de type p. La découverte de ce nouveau p-TCOs a été valorisée et validée par l'élaboration d'une homojonction p - n transparente. Les matrices d'oxyde de titane rutile et anatase ont également été utilisées pour accueillir des ions terres rares Ln3+ afin de convertir les photons ultra-violet du spectre solaire incident vers le proche infrarouge (800 > λ > 1100 nm). Le transfert d'énergie des matrices TiO2 vers les dopants Ln3+ a été étudié en fonction de la structure, de la quantité de dopant ainsi que la qualité de la microstructure des films dopés Ln3+ (Ln3+=Pr3+,Tm3+,Eu3+,Yb3+,Nd3+).

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