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10. Strong Fermi-level pinning at metal contacts to halide perovskites

Author

Hong, Kootak, Kwon, Ki Chang, Choi, Kyoung Soon, Le, Quyet Van, Kim, Seung Ju, Han, Ji Su, Suh, Jun Min, Kim, Soo Young, Sutter-Fella, Carolin M, and Jang, Ho Won

Subjects
Macromolecular and Materials Chemistry, Chemical Sciences, Physical Chemistry, Physical Chemistry (incl. Structural), Materials Engineering, Macromolecular and materials chemistry, Physical chemistry, Materials engineering
Abstract

The performance of halide perovskite-based electronic and optoelectronic devices is often related to interfacial charge transport. To shed light on the underlying physical and chemical properties of CH3NH3PbI3 (MAPbI3) in direct contact with common electrodes Al, Ti, Cr, Ag, and Au, the evolution of interfacial properties and Fermi level pinning is systematically studied. Given a unique experimental facility, pristine interfaces without any exposure to ambient air were prepared. We observe aggregation of substantial amounts of metallic lead (Pb0) at the metal/MAPbI3 interface, resulting from the interfacial reaction between the deposited metal and iodine ions from MAPbI3. It is found that the Schottky barrier height at the metal/MAPbI3 interface is independent of the metal work function due to strong Fermi level pinning, possibly due to the metallic Pb0 aggregates, which act as interfacial trap sites. The charge neutrality level of MAPbI3 is consistent with the energy level of Pb0-related defects, indicating that Pb0 interfacial trap states can be nonradiative recombination sites. This work underlines that control of chemical bonding at interfaces is a key factor for designing future halide perovskite-based devices.

Published
2021

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