Search

Details the development of lead-free electrically conducting adhesive material to be used for via filling in printed circuit boards. Generic process for the build-up multilayer technology; Development of a class of conductive adhesive materials; Measurement of the bulk properties of the conducting adhesive materials.

Near-infrared detectors based on metal-insulator-metal tunnel junctions integrated with planarized silicon nanowire waveguides are presented, which we believe to be the first of their kind. The junction is coupled to the waveguide via a thin-film metal antenna feeding a plasmonic travelling wave structure that includes the tunnel junction. These devices are inherently broadband; the design presented here operates throughout the 1500-1700 nm region. Careful design of the antenna and travelling wave region substantially eliminates losses due to poor mode matching and RC rolloff, allowing efficient operation. The antennas are made from multilayer stacks of gold and nickel, and the active devices are Ni-NiO-Ni edge junctions. The waveguides are made via shallow trench isolation technology, resulting in a planar oxide surface with the waveguides buried a few nanometres beneath.The antennas are fabricated using directional deposition through a suspended Ge shadow mask, using a single level of electron-beam lithography. The waveguides are patterned with conventional 248-nm optical lithography and reactive-ion etching, then planarized using shallow-trench isolation technology. We also present measurements showing overall quantum efficiencies of 6% (responsivity 0.08 A/W at 1.605 mum), thus demonstrating that the previously very low overall quantum efficiencies reported for antenna-coupled tunnel junction devices are due to poor electromagnetic coupling and poor choices of antenna metal, not to any inherent limitations of the technology.